Direct Inkjet Printing Embedded Chips PCB Fabrication

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The existing methods for embedding chips in printed circuit boards (PCBs) are time-consuming and costly, requiring extensive prototyping, quality assurance tests, and fault tolerance tests, with risks of exposing trade secrets and high costs associated with faulty designs during mass production.

Innovation Solution

A system and method for direct inkjet printing of PCBs with embedded chips using a combination of print heads with conductive and dielectric ink compositions, creating predetermined slots for chip placement and encapsulation, while maintaining interconnectedness among the embedded chips, utilizing a computer-aided manufacturing module to control the printing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional chip embedding methods are used, then manufacturing precision and reliability are achieved, but fabrication time and cost increase significantly

Engineering Contradiction:

Improvechip embedding precisionVSAvoidfabrication time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent combines multiple separate fabrication steps (substrate preparation, chip mounting, encapsulation, and circuit trace formation) into a single integrated inkjet printing process. The inkjet system deposits conductive, dielectric, and encapsulant materials in sequential layers, embedding chips during the printing process itself, thereby eliminating multiple discrete manufacturing steps and reducing overall fabrication time while maintaining precision.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention changes the fundamental parameters of the fabrication process by using inkjet printing technology with controllable deposition parameters (droplet size, spacing, layer thickness, and curing conditions). This allows precise control over material placement and chip embedding depth, achieving high manufacturing precision through digital parameter control rather than mechanical tooling.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If traditional prototyping and testing processes are followed, then product reliability is ensured, but development time and cost increase

Engineering Contradiction:

Improveproduct reliabilityVSAvoiddevelopment speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The inkjet printing process performs preliminary actions by embedding chips and forming circuit traces simultaneously in the same manufacturing step. The system deposits conductive traces, places chips in designated areas, and applies encapsulant material in one integrated process, performing multiple functions that would traditionally require separate prototyping and assembly steps, thereby accelerating development while ensuring reliability through controlled deposition.

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If complex PCB geometries are manufactured using conventional methods, then manufacturing precision is maintained, but process complexity and cost increase

Engineering Contradiction:

ImprovePCB geometry precisionVSAvoidfabrication process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical fabrication systems (laser drilling, electroplating, lamination, and manual assembly equipment) with an inkjet printing system that uses digitally controlled material deposition. The inkjet system can create complex 3D geometries and multi-layer structures through software-controlled droplet placement, eliminating the need for multiple mechanical processing steps and reducing overall process complexity while maintaining high precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the time and cost associated with fabrication and assembly, enables better control over complex geometries, and facilitates rapid prototyping and mass production of PCBs with embedded chip components, while maintaining the security of trade secrets.

Implementation Method 1

direct inkjet printing of printed circuit boards (PCBs) with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions

Methodology Applied

Scientific EffectInkjet printing:

Implementation Method 2

a UV lamp configured to cure the dielectric resin ink

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS10980131B2Chip embedded printed circuit boards and methods of fabrication

Publication Date: 2021.04.13 NANO DIMENSIONS TECH LTD

AI summary

The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.