Inkjet Printing on Heat-Sensitive Substrates via Vacuum Pattern
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Solution Overview
Problem
Current inkjet printing devices with vacuum supports struggle to handle heat-sensitive substrates effectively, leading to issues like structural integrity loss, crinkling, and poor print quality due to the need for specific handling and tuning of parameters.
Innovation Solution
The method involves jetting a pattern with a specific surface roughness on the vacuum support to enhance the connection between the substrate and the vacuum support, minimizing structural integrity loss and crinkling, and allowing for easy removal and reuse of the pattern for different substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the vacuum table temperature is tuned or dryer radiation is adjusted to handle heat-sensitive substrates, then the substrate can be printed on, but the structural integrity of the substrate is lost causing crinkling and poor print quality
Solution Approach 1:
A pattern layer is introduced as an intermediary between the vacuum table and the heat-sensitive substrate. This pattern acts as a thermal mediator that allows vacuum holding while providing cooling functionality to maintain substrate structural integrity during printing operations
2Adaptability or versatility
If multiple inkjet printing devices are used to handle different substrate types, then all substrate types can be printed on, but device complexity and calibration requirements increase
Solution Approach 1:
The vacuum table is enhanced with a configurable pattern system that can be adjusted for different substrate types, particularly heat-sensitive ones. This makes a single inkjet printing device capable of handling multiple substrate types through pattern configuration rather than requiring multiple specialized devices
Solution Approach 2:
The pattern on the vacuum table is made dynamically configurable to adapt to different substrate requirements. The pattern can be modified or reconfigured based on the specific substrate type being printed, allowing one device to serve multiple functions without extensive recalibration
3Strength
If the vacuum table surface is modified to improve substrate holding, then substrate connection is enhanced, but the ability to handle different substrate types is reduced
Solution Approach 1:
The vacuum table surface features a configurable pattern that can be dynamically adjusted or reconfigured based on the substrate type. This dynamic adaptability allows the surface to optimize its holding characteristics for each specific substrate while maintaining versatility across different substrate types
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient printing on a wide range of substrates, including heat-sensitive ones, by improving hold-down and reducing crinkling and structural integrity issues, thereby enhancing print quality and productivity without requiring frequent device calibration or substrate-specific settings.
Implementation Method 1
a vacuum support for holding-down a substrate (500) against the support surface from the vacuum support by air suction
Implementation Method 2
jetting a set of layers by a set of liquids on the support surface to form a pattern (102) with a surface roughness between 2.0 μm and 200.0 μm and rougher than the surface roughness of the support surface
Data Source
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Figure 7
AI summary
Inkjet printing method by an inkjet printing device (300) wherein the inkjet printing device (300) comprises a vacuum support for a substrate (500) wherein the substrate (500) is hold down against the support surface of the vacuum support by air suction; and wherein the inkjet printing method comprises a step of jetting a set of layers by a set of liquids on the support surface to form a pattern (102) with a surface roughness between 2.0 µm and 200.0 µm and rougher than the surface roughness of the support surface; and a step of supporting the substrate (500) at least partially on the pattern (102).