Inkjet Resin Composition for Printed Wiring Board Insulation
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Solution Overview
Problem
Existing resin compositions for inkjet printing used in forming insulation layers on printed wiring boards face limitations in achieving desired physical properties such as low viscosity, excellent pigment dispersion, storage stability, adhesion, insulation, plating resistance, and strength, which are essential for efficient and reliable printed wiring board production.
Innovation Solution
A resin composition for inkjet printing is developed, comprising an epoxy resin, a monofunctional acrylate-based monomer with a cyclic structure, a heat curable acrylate-based monomer, a viscosity adjusting agent, and a photoinitiator, which together enhance adhesion, heat resistance, plating resistance, and storage stability, allowing for efficient photocuring and heat curing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional printing methods (screen printing, curtain printing, spray coater, dip coater) are used to form insulation layers, then complete coverage and adhesion can be achieved, but the manufacturing process becomes complex and preparation efficiency deteriorates due to multiple sequential steps including initial printing, drying, exposure, development, heat curing, and UV curing
Solution Approach 1:
The patent extracts and eliminates the unnecessary exposure and development steps from the conventional printing process. By using a resin composition that cures directly upon printing without requiring photographic development processes, the method reduces the complex multi-step process into simpler printing and curing steps, thereby improving preparation efficiency while maintaining complete coverage and adhesion.
Solution Approach 2:
The resin composition is formulated with pre-selected components including epoxy resin, monofunctional acrylate-based monomer with cyclic structure, heat curable acrylate-based monomer, and photoinitiator in specific proportions. This preliminary formulation ensures that the resin composition has optimal viscosity, pigment dispersion, and storage stability before printing, eliminating the need for subsequent adjustment steps and reducing overall process complexity.
2Ease of manufacture
If inkjet printing method is used to form insulation layers, then the manufacturing process is simplified and contaminants from exposure and development are eliminated, but the resin composition fails to achieve desired physical properties including low viscosity, excellent pigment dispersion, storage stability, adhesion, insulation, plating resistance, and strength
Solution Approach 1:
The patent employs a composite resin composition comprising epoxy resin as the base material, monofunctional acrylate-based monomer with cyclic structure for low viscosity and excellent pigment dispersion, heat curable acrylate-based monomer for enhanced adhesion and plating resistance, and photoinitiator for curing. This composite formulation integrates multiple material functions into a single composition that achieves all desired physical properties while maintaining process simplicity of inkjet printing.
Solution Approach 2:
The patent optimizes the physical and chemical parameters of the resin composition by carefully selecting the molecular structure of the monofunctional acrylate-based monomer (with cyclic structure for low viscosity), adjusting the molecular weight and functional groups of the heat curable acrylate-based monomer (for enhanced adhesion), and controlling the concentration of photoinitiator. These parameter changes enable the resin composition to achieve low viscosity, excellent pigment dispersion, storage stability, adhesion, insulation, plating resistance, and strength simultaneously.
3Ease of operation
If the resin composition is formulated for low viscosity to enable inkjet printing, then printability is improved, but adhesion property, insulation property, plating resistance, strength, and other performance characteristics deteriorate
Solution Approach 1:
The patent applies local quality by assigning different functional roles to different components of the resin composition: the monofunctional acrylate-based monomer with cyclic structure provides low viscosity for printability in the liquid state, while the epoxy resin and heat curable acrylate-based monomer provide adhesion and strength after curing. The photoinitiator enables localized curing upon light exposure. This functional differentiation allows the composition to exhibit low viscosity during printing (ease of operation) while achieving excellent adhesion, insulation, plating resistance, and strength after curing (reliability).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition exhibits excellent physical properties, including improved viscosity, storage stability, adhesion, and plating resistance, enabling the production of printed wiring boards with enhanced service life and reliability, while simplifying the manufacturing process and reducing environmental impact.
Implementation Method 1
a photoinitiator... allowing for efficient photocuring
Implementation Method 2
a heat curable acrylate-based monomer... allowing for efficient photocuring and heat curing processes
Data Source
AI summary
The present invention relates to a resin composition for inkjet printing used to form a resin layer serving as an insulation layer of a printed wiring board by an inkjet printing method.