Inkjet-Printed RF and mmWave Circuits for Tunable Multilayer Fabrication
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Solution Overview
Problem
Existing methods struggle to efficiently fabricate reconfigurable and tunable mmWave RF circuits with high accuracy and low cost, particularly in small form factor electronic devices, which are essential for emerging technologies like 5G and millimeter wave communication.
Innovation Solution
The method involves direct and indirect inkjet printing using a system with two print heads for dielectric and conductive inks, controlled by a computer-aided manufacturing module, to form multilayered RF and mmWave circuits, including buried waveguides, antennas, and amplifiers, enabling continuous or semi-continuous fabrication of tunable and reconfigurable RF and mmWave AME circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional fabrication methods are used for RF and mmWave circuits, then manufacturing precision can be achieved, but production efficiency is low and cost is high
Solution Approach 1:
The fabrication process is segmented into multiple sequential printing steps, where different ink compositions (conductive, dielectric, functional) are deposited in separate passes. This allows each material type to be optimized independently while maintaining overall production efficiency through continuous processing.
Solution Approach 2:
The patent employs variable printing parameters including ink composition ratios, printing speed, layer thickness, and sintering temperatures. These parameters are dynamically adjusted based on the specific circuit requirements to achieve both high precision and efficient production.
2Volume of moving object
If small form factor devices are designed, then device compactness is improved, but circuit placement complexity increases
Solution Approach 1:
The patent transitions from planar 2D circuit layouts to 3D multilayer structures by printing conductive, dielectric, and functional layers in stacked configurations. This vertical dimensionality allows compact integration of multiple circuit functions within a small footprint while managing complexity through layered organization.
Solution Approach 2:
Multiple circuit elements and functional layers are nested within each other in a hierarchical structure, where smaller functional units are embedded within larger structural layers. This nesting approach maximizes space utilization in small form factor devices while organizing complexity into manageable hierarchical levels.
3Adaptability or versatility
If reconfigurable and tunable antenna characteristics are implemented, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent incorporates dynamically reconfigurable elements such as variable capacitance structures, adjustable inductance patterns, and programmable conductive pathways that can change antenna characteristics post-fabrication. These dynamic elements are integrated through additive printing, allowing complexity to be managed through software control rather than fixed hardware configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient fabrication of multilayered RF and mmWave circuits with tunable characteristics, enhancing functionality in small form factor devices, supporting dynamic changes in antenna characteristics and improving production efficiency.
Implementation Method 1
providing an ink jet printing system comprising: a first print head, sized and configured to dispense a dielectric ink composition; a second print head sized and configured to dispense a conductive ink composition
Implementation Method 2
a conveyor, operably coupled to the first, and the second print heads configured to convey a substrate to each of the first, and the second print heads
Implementation Method 3
curing the pattern corresponding to the dielectric ink representation in the 2D layer of the multilayer PCB
Implementation Method 4
sintering the pattern corresponding to the conductive ink
Implementation Method 5
methods for forming reconfigurable and/or tunable RF and/or MMW AME circuit applications in multilayered Additively Manufactured Electronics (AME)
Data Source
AI summary
The disclosure relates to mmWave RF (MMW) circuits made by methods of Additively Manufactured Electronics (AME). Specifically, the disclosure relates to reconfigurable and/or tunable RF and/or MMW circuits made by direct and/or indirect inkjet printing.