Inkjet Stage Thermal Gradient for Vertical Resin Sidewalls
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Solution Overview
Problem
Existing inkjet printing methods struggle to form a desired profile, particularly a vertical sidewall edge, in resin application, leading to increased dead space and inefficiencies.
Innovation Solution
An inkjet printing apparatus with multiple stages having varying thermal conductivities, including a first stage part with low thermal conductivity and a second stage part with higher thermal conductivity, creates a temperature gradient that induces resin migration to form a steep profile at the edge without additional coating processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a single-stage substrate table is used for inkjet coating, then the device structure is simple, but the resin edge profile cannot achieve vertical sidewall shape
Solution Approach 1:
The substrate table is divided into multiple stage parts (first stage part, second stage part, third stage part) with different thermal conductivities. Each stage part independently controls the temperature of specific resin regions, enabling precise profile control at resin edges while maintaining overall system manageability.
Solution Approach 2:
Different stage parts have different thermal conductivity properties tailored to specific locations. The first stage part has low thermal conductivity to maintain resin temperature in the center region, while the second and third stage parts have high thermal conductivity to cool resin at edge regions, creating the desired vertical sidewall profile.
2Shape
If multiple inkjet coating processes are used to form vertical sidewall profile, then the resin edge profile improves, but the number of processes and equipment increases
Solution Approach 1:
The multi-stage substrate table automatically controls resin profile formation through differential thermal conduction during a single coating process. The temperature gradient created by different stage parts naturally guides resin flow to form vertical sidewalls, eliminating the need for multiple coating passes or additional profile-adjustment equipment.
Solution Approach 2:
The patent replaces mechanical multi-pass coating processes with a thermal field-based single-pass coating system. By using temperature control through different thermal conductivity stage parts, the system achieves profile control that would otherwise require multiple mechanical coating operations.
3Manufacturing precision
If additional coating processes are added to improve resin profile, then the edge profile accuracy improves, but equipment investment costs increase
Solution Approach 1:
The multi-stage substrate table serves multiple functions simultaneously: it supports the substrate, controls temperature distribution, and shapes resin profile during a single operation. This integrated design achieves high edge profile accuracy without requiring separate profile-forming equipment or additional coating systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently forms a vertical sidewall edge profile with reduced dead space and equipment costs by controlling resin distribution through thermal conductivity differences.
Implementation Method 1
a second stage part surrounding at least part of the first stage part, and having a second thermal conductivity that is higher than the first thermal conductivity
Implementation Method 2
Resin on the first region may be at a higher temperature than resin on the second region
Data Source
AI summary
An inkjet printing apparatus according to an embodiment includes a stage for supporting a substrate and an inkjet head disposed above the stage and discharging resin toward the stage. The stage includes a first stage part having a first thermal conductivity, and a second stage part disposed around the first stage part and surrounding at least a portion of the first stage part, wherein the second stage part has a second thermal conductivity that is greater than the first thermal conductivity.