Inkjet Trench Structure for High Aspect Ratio Solar Battery Patterns
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Solution Overview
Problem
Current methods for manufacturing patterns, such as photolithography, imprint lithography, and roll printing, face challenges in forming patterns with desired widths and thicknesses, particularly fine patterns with high aspect ratios, due to limitations in precision, repeatability, and increased manufacturing costs.
Innovation Solution
A method involving the formation of a trench structure on a substrate using an inkjet method with hot melt ink, followed by filling and removing the trench structure, which allows for the creation of patterns with a high aspect ratio and desired dimensions, using conductive or insulating materials like silver, copper, or carbon nanotubes, and employing thermal or solution treatment processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography method is used to form patterns, then pattern width can be controlled by light wavelength, but it becomes difficult to form fine patterns with high aspect ratio due to light interruption and requires expensive equipment and masks
Solution Approach 1:
The patent replaces the optical-based photolithography system with a direct printing system that uses a printing head to deposit material directly onto the substrate. This mechanical deposition approach eliminates light interruption issues and enables formation of fine patterns with high aspect ratios without requiring expensive optical equipment and masks
Solution Approach 2:
The patent introduces a binder material as an intermediary that allows direct material deposition. The binder serves as a medium to carry and deposit pattern-forming materials precisely onto the substrate, enabling fine pattern formation with controlled width and high aspect ratio that cannot be achieved through conventional photolithography
2Reliability
If photolithography method is used to form patterns, then pattern formation is achievable through established processes, but multiple processes including exposure, baking, development, and etching are required resulting in long processing time and reduced productivity
Solution Approach 1:
The patent merges multiple separate photolithography processes (exposure, baking, development, etching) into a single direct printing operation. The printing head deposits pattern-forming material directly onto the substrate in one step, eliminating the need for sequential processing and significantly reducing manufacturing cycle time while maintaining pattern formation reliability
Solution Approach 2:
The patent performs preliminary preparation of the printing head and material deposition system before the actual printing process. This preliminary setup enables direct pattern formation without requiring subsequent processing steps, thereby reducing overall manufacturing cycle time while ensuring reliable pattern formation
3Device complexity
If imprint lithography or roll printing method is used to form patterns, then process complexity is reduced compared to photolithography, but limitations remain in forming patterns with desirable width and thickness particularly fine patterns with high aspect ratio
Solution Approach 1:
The patent applies local quality control by enabling independent adjustment of deposition parameters at different locations and for different materials. The printing system can precisely control material deposition locally to achieve desired pattern width and thickness, including fine patterns with high aspect ratio, while maintaining simpler process complexity compared to photolithography
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient manufacturing of patterns with varying shapes and high aspect ratios, improving the aspect ratio of solar battery electrodes, thereby enhancing the light receiving area and overall efficiency of solar batteries.
Implementation Method 1
forming a trench structure on a substrate by an inkjet method, using hot melt ink
Implementation Method 2
forming a trench structure on a substrate by an inkjet method
Implementation Method 3
removing the trench structure, wherein the trench structure is formed by an inkjet method, using hot melt ink
Implementation Method 4
removing the trench structure
Data Source
AI summary
The present disclosure provides a method of manufacturing a pattern including: forming a trench structure on a substrate using an inkjet method; filling an interior portion of the trench structure with a filler; and removing the trench structure, and a pattern manufactured using the same, and a method of manufacturing a solar battery using the method of manufacturing a pattern and a solar battery manufactured using the same.