Inkjet Printed Electric Wiring Using Guide Trenches
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Solution Overview
Problem
Current methods for forming electric wiring with fine line widths using inkjet printing face challenges in achieving uniform line widths and preventing ink bulging, especially when applying conductive materials to substrates with varying surface properties.
Innovation Solution
The method involves forming a main trench and guide trenches on a substrate, using inkjet printing to eject conductive ink with a contact angle greater than 30 degrees, followed by sintering at temperatures between 100° C to 500° C, and performing ink-repulsive surface treatments like fluorine coating to ensure uniform wiring formation and prevent ink bulging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If inkjet printing is used to form electric wiring with fine line widths, then the line width can be reduced to 1-50 μm, but ink bulging occurs and uniform line width cannot be achieved
Solution Approach 1:
The single trench structure is divided into multiple segments by introducing guide trenches that extend from the main trench toward the ink ejection path. These guide trenches segment the ink flow path and provide lateral confinement, preventing ink bulging while maintaining fine line width control during the printing process
Solution Approach 2:
The guide trenches are formed in advance before the inkjet printing process. This preliminary structuring of the substrate creates predetermined pathways that guide and confine the ink as it is ejected, ensuring uniform line width from the beginning of the printing process without requiring real-time adjustment
2Reliability
If the substrate surface is treated to improve ink adhesion, then wiring formation is enhanced, but ink bulging increases due to excessive ink spreading
Solution Approach 1:
The substrate surface is treated with different properties in different regions: the main trench area has one surface treatment for optimal ink adhesion and wiring formation, while the guide trench areas have contrasting surface properties that create capillary pressure differences. This local differentiation allows the ink to adhere properly where needed while being confined laterally by the guide trenches, preventing bulging
Solution Approach 2:
The surface treatment parameters are optimized to achieve a specific contact angle range for the ink. By controlling the surface energy and wettability parameters, the ink exhibits appropriate adhesion to form continuous wiring while the capillary pressure generated by the surface treatment differences prevents excessive spreading and bulging
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of electric wiring with consistent line widths and reduced ink bulging, allowing for the creation of conductive pathways with metal nanoparticles, suitable for applications in displays and sensors.
Implementation Method 1
an inkjet printing apparatus is an apparatus for printing a predetermined image by ejecting micro-droplets of ink to a desired location on a printing medium through a nozzle of an inkjet head
Implementation Method 2
heating the substrate to, sinter the ink such that the electric wiring is formed
Implementation Method 3
contract the ink such that a tunnel is formed in a lower portion of the main trench
Implementation Method 4
performing an ink-phobic surface treatment with respect to a surface of the substrate after forming the main trench and the first and second guide trenches
Data Source
AI summary
Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench.