Inkless Markers for Partial Wafer Processing

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Solution Overview

Problem

Traditional methods for processing semiconductor wafers are inadequate for handling inkless partial wafers, often requiring specialized hardware and software, making it difficult to implement and transport across multiple vendors or contractors, and lack a method to process partial wafers using wafer maps effectively.

Innovation Solution

A system and method for fabricating a full wafer with an orientation marker and a reference die, where a reticle pattern is configured in an array with inkless markers between columns, allowing the wafer to be cut into partial wafers that can be processed using the same tools as full wafers, with a pseudo reference die used for placement, enabling processing without additional equipment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional methods are used to process inkless partial wafers, then specialized hardware and software are required, but this increases device complexity and reduces ease of operation

Engineering Contradiction:

Improveease of processing partial wafersVSAvoidspecialized hardware and software requirements

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The full wafer is segmented into multiple partial wafers by introducing inkless markers that define cut lines. Each partial wafer can be independently processed using standard equipment, eliminating the need for specialized hardware while maintaining processing capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inkless markers serve as intermediaries between the full wafer and partial wafer processing systems. These markers provide reference information that enables standard pick-and-place equipment to locate and process dies on partial wafers without requiring specialized hardware or software modifications.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If inkless markers are placed between columns of reticle patterns, then partial wafers can be processed using standard tools, but the reticle pattern configuration becomes more complex

Engineering Contradiction:

Improvecompatibility with standard pick-and-place systemsVSAvoidreticle pattern configuration

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The reticle pattern is configured with local variations: inkless markers are placed specifically between certain columns rather than uniformly across the entire wafer. This localized approach provides the necessary reference information for partial wafer processing while minimizing the overall complexity of the reticle configuration.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Instead of placing inkless markers throughout the entire wafer, the solution uses partial action by positioning markers only between specific columns where partial wafer cuts are anticipated. This reduces the total number of markers needed while still providing sufficient reference information for processing.

Inventive Principle:

Principle #16Partial or excessive action

3Productivity

If partial wafers are cut from full wafers, then inventory is reduced and just-in-time manufacturing is enabled, but the reference die may be lost in some partial wafers

Engineering Contradiction:

Improveinventory reduction and just-in-time manufacturingVSAvoidavailability of reference die for positioning

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

Inkless markers are placed in advance during wafer fabrication at positions that will define the boundaries of partial wafers. This preliminary action ensures that even when the original reference die is cut away, the inkless markers remain to provide reference information for positioning during subsequent processing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The inkless markers effectively copy the reference function of the original reference die. By placing these markers at strategic locations, the system creates duplicate reference points that can serve the same positioning purpose even when the original reference die is not present in a given partial wafer.

Inventive Principle:

Principle #26Copying

Data Source

PatentUS7915087B2Method of arranging dies in a wafer for easy inkless partial wafer process

Publication Date: 2011.03.29 TEXAS INSTRUMENTS INC

AI summary

In a method and system for fabricating a full wafer (600) having dies, an orientation marker (606), and a reference die (608), includes configuring a reticle pattern (602) that is configured by arranging the dies in an array having m rows and n columns, where the m rows start in a row adjacent to the orientation marker (606), and m and n are integers. The reticle pattern (602) is transferred to the full wafer (600) to sequentially form a portion of the dies. The transferring includes placing an inkless marker (620) in the form of one or more non-circuit dies between the n columns of adjacent reticle patterns. The reticle pattern (602) is repeatedly transferred to form a remaining portion of the dies to complete the full wafer (600). A wafer map for the full wafer (600) is stored, with the wafer map including a non-circuit bin containing data describing the inkless marker (620).