Circuit Board Inlay Positioning via Segmented Elements
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Solution Overview
Problem
Existing methods for producing printed circuit boards with inlays require individual machining of recesses for each inlay, leading to large gaps and increased resin usage, resulting in higher thermal resistance and less efficient lamination processes.
Innovation Solution
A method involving the creation of larger recesses in the circuit board layer with positioning elements for multiple inlays, allowing precise placement with small gaps, reducing resin needed and enabling a layer structure with lower thermal resistance, where positioning elements are later separated to avoid short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual recesses are milled for each inlay, then positioning precision is achieved, but gap width becomes large (1-2 mm) and resin usage increases
Solution Approach 1:
The invention divides the positioning function into two segments: positioning elements on the inlays and complementary alignment elements on the frame. This segmentation allows the inlays to be precisely positioned relative to each other while minimizing gaps, as each inlay is independently positioned by its own positioning elements rather than relying on individually milled recesses.
Solution Approach 2:
Instead of creating recesses in the frame for each inlay (traditional approach), the invention inverts the approach by providing positioning elements on the inlays themselves that engage with alignment elements on the frame. This inversion allows for smaller gaps between inlays since the positioning is achieved through the positioning elements rather than through recess geometry.
2Ease of operation
If larger gaps between inlays are used, then easier insertion and processing is achieved, but thermal resistance increases and lamination efficiency decreases
Solution Approach 1:
The invention replaces the mechanical system of individual recesses with a positioning element and alignment element system that uses precise geometric engagement. This substitution allows for smaller gaps (around 100 μm) while maintaining ease of insertion, as the positioning elements guide the inlays into place without requiring large clearance gaps.
Solution Approach 2:
The invention changes the gap parameter from 1-2 mm to around 100 μm by implementing a new positioning mechanism. This parameter change is enabled by the positioning elements that provide precise location control, allowing the gap to be reduced without compromising insertion ease or processingability.
3Productivity
If multiple inlays are placed in a larger recess, then productivity increases, but positioning precision and static fixation become difficult to achieve
Solution Approach 1:
The positioning elements serve multiple functions: they provide precise positioning of inlays relative to each other, enable static fixation during processing, and facilitate easy insertion when combined with alignment elements. This multi-functionality allows multiple inlays to be placed in a larger recess while maintaining high positioning precision and productivity.
Solution Approach 2:
The positioning elements act as intermediaries between the inlays and the frame structure. These intermediary elements enable precise positioning and static fixation of multiple inlays within a larger recess, resolving the conflict between high-density placement and positioning precision by providing a mediating positioning mechanism.
4Strength
If positioning elements are not separated after lamination, then structural integrity is maintained, but short circuits may occur between inlays
Solution Approach 1:
The invention segments the positioning elements into conductive and non-conductive types, or designs them to be removable. This segmentation allows the positioning function to be separated from the final circuit structure, enabling the positioning elements to be removed after serving their purpose during lamination, thereby eliminating the short circuit risk while maintaining structural integrity during the critical lamination phase.
Solution Approach 2:
The positioning elements perform their positioning and fixation function preliminarily during the lamination process, and are then removed in a subsequent step. This preliminary action allows the inlays to be properly positioned and fixed during manufacturing, and then the positioning elements are discarded after they have served their purpose, preventing short circuits in the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for closer inlay placement with reduced resin usage, resulting in lower thermal resistance and more efficient lamination, while maintaining static fixation and avoiding unwanted contact during processing.
Implementation Method 1
The inlays (21 to 24) each have positioning elements (21.1 to 22.6), with which correspondingly complementary alignment elements (12.1 to 12.6) engage on the frame of the circuit board layer (12)
Implementation Method 2
a gap existing between the insert and the recess being filled with resin liquefied by the compression pressure by pressing the layer arrangement
Implementation Method 3
resin liquefied by the compression pressure by pressing the layer arrangement
Data Source
Figure 1
Figure 2a~2b
Figure 3~4
AI summary
The invention relates to a method for producing a circuit board (10) having a plurality of inlays (21, 22, 23, 24), comprising the following steps: providing a plurality of inlays (21, 22, 23, 24), of which at least one inlay has at least one positioning element (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2); constructing a layer sequence of a plurality of circuit board layers, having at least one recess (14) for accommodating inlays, wherein the recess (14) is defined by a frame of non-conductive circuit board material before the step of inserting the plurality of inlays (21, 22, 23, 24) in a topmost layer (12); inserting the plurality of inlays (21, 22, 23, 24) into the recess (14) defined by the frame; covering the inlays (21, 22, 23, 24) with a non-conductive circuit board material; laminating the layer sequence and removing at least the positioning elements (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2) that provide a conductive contact between adjacent inlays.