Inlay Production with Dual Image Capture for Component Alignment
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Solution Overview
Problem
Existing methods for producing inlays for film composites often result in inaccurate placement of electronic components within cutouts, leading to waste and manufacturing tolerances that affect the visual appearance and functionality of the final product.
Innovation Solution
A method and device that utilize image capturing devices to precisely record and transmit the positions of electronic components on a carrier film, allowing for real-time adjustment of cutting devices to ensure accurate placement of components within recesses in compensating films, using lasers, cutting plotters, or water jet cutting, and incorporating a control loop to maintain precise alignment during the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single image capturing device is used to record electronic component positions, then the production process is simple, but the placement accuracy of electronic components within cutouts is insufficient
Solution Approach 1:
The patent divides the image capturing process into two separate devices: a first image capturing device that records electronic component positions on the carrier film, and a second image capturing device that records the actual placement positions after assembly. This segmentation allows each device to focus on specific measurement tasks, thereby improving overall placement accuracy while maintaining manageable system complexity through clear functional division.
Solution Approach 2:
The patent implements a feedback mechanism where the second image capturing device monitors the actual placement of electronic components in the cutouts, and this information is fed back to adjust the cutting device. This closed-loop feedback system continuously improves placement accuracy by detecting and correcting deviations from the intended positions.
2Manufacturing precision
If the cutout size is made larger to ensure electronic component placement, then placement accuracy is improved, but the visual appearance of the final product is impaired
Solution Approach 1:
The feedback mechanism from the second image capturing device allows for precise measurement of actual placement positions. This enables the system to determine the minimum necessary cutout size required for accurate placement, rather than using oversized cutouts as a safety margin. The feedback data guides optimization of cutout dimensions to achieve both placement accuracy and aesthetic appearance.
Solution Approach 2:
The patent uses image processing and measurement data to dynamically adjust the cutout parameters (size and position) based on actual electronic component locations. This parameter optimization ensures that cutouts are precisely sized to accommodate components without being excessively large, thereby maintaining both placement accuracy and visual appearance of the final product.
3Manufacturing precision
If manual adjustment methods are used to correct placement errors, then flexibility is maintained, but productivity is reduced
Solution Approach 1:
The automated feedback system from the second image capturing device continuously monitors placement accuracy and provides real-time correction data to the cutting device. This automated closed-loop control eliminates the need for manual inspection and adjustment, maintaining high placement accuracy while significantly improving production efficiency through continuous automated operation.
Solution Approach 2:
The patent replaces manual mechanical adjustment methods with an automated optical measurement and control system. The image capturing devices and control system automatically detect placement deviations and guide corrections, substituting human operators with automated machinery that maintains precision while increasing production speed and efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces waste and manufacturing tolerances, ensuring that electronic components are accurately positioned within cutouts, enhancing the efficiency and quality of the inlay production process.
Implementation Method 1
a first image capturing device records at least the position of an electronic component detected
Implementation Method 2
The laser cuts gaps at the appropriate points in the at least one compensating film
Implementation Method 3
A laser, a cutting plotter, a water jet cutting device, a punching device or any other suitable device can be used as the cutting device
Implementation Method 4
a second image capturing device is provided, which captures data on the position of at least one electronic component on the carrier film in relation to the recess in the at least one compensating film assigned to it
Data Source
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AI summary
Producing inlay for a film composite, preferably an inlay for further processing into a value- or security document, comprises (a) supplying a carrier film (16), (b) supplying at least one compensating film (12) to cutting device (10), (c) transmitting data on the position of respective electronic components to the cutting device, and controlling the cutting device for producing recesses, (d) combining the compensating film and the carrier film, and fixing accurate register to an inlay, (e) providing a second image capturing device, transmitting the data, and controlling the cutting device. Producing inlay for a film composite, preferably an inlay for further processing into a value- or security document, comprises (a) supplying a carrier film (16) having several electronic components (18) of a first image capturing device (2), which are arranged on the carrier film and associated with each other, where the first image capturing device detects at least one position of the electronic component, (b) supplying at least one compensating film (12) applied on the carrier film to a cutting device (10), (c) transmitting data on the position of respective electronic components on the carrier film to the cutting device, which is detected by the first image capturing device, and controlling the cutting device for producing recesses, which are matched to the respective positions of the electronic components, (d) combining the compensating film having the recesses and the carrier film in a merging station, and fixing accurate register aligned with each other to an inlay, (e) providing a second image capturing device after the merging station, which detects the data on the position of the electronic components on the carrier film with respect to the recesses in the compensating sheet, transmitting the data to the cutting device, and controlling the cutting device for producing recesses in the compensating sheet such that the electronic components on the carrier film are located within the recesses of the compensating sheet. An independent claim is also included for a device for producing the inlay for film composite, preferably inlay for further processing into the value or security document, comprising (i) a first supplying device for the carrier film, (ii) the first image capturing device that supplies the carrier film having several electronic components that are arranged on the carrier film and associated with each other, where first image capturing device detects the position of the electronic component, (iii) the cutting device that supplies the compensating film applied on the carrier film by a second supplying device, (iv) a first transmitting device, which transmits data that is detected by the first image capturing device, on the position of the electronic component on the carrier film to the cutting device, (v) a control device that controls the cutting device, where the recesses are matched at the respective positions of the electronic components according to the data transmitted to the cutting device, (vi) the merging station, where the compensating film having recesses and the carrier film are combined, and accurate register aligned with each other is fixed to the inlay, (vii) the second image capturing device that is arranged after the merging station, detects the data on the position of the electronic component on the carrier film in relation to the respectively associated recesses for the electronic component in the compensating sheet, and (viii) a second transmitting device that transmits the data to the cutting device, where the cutting device is controlled by the control device such that the electronic components on the carrier film is located within the recess of the compensating sheet.