Inline Board-to-Board Connector Architecture for Ultra-Slim Devices

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Solution Overview

Problem

Traditional board-to-board connectors in slim computing devices face challenges such as unwanted electromagnetic frequency (EMF) discharge and limited z-dimension, leading to custom and costly manufacturing solutions that are not suitable for high-volume production, while also restricting the design of slim computing devices like smartphones and laptops.

Innovation Solution

The development of ultra slim module (USM) connectors, including inline and top mount USM connectors with a low profile design, which feature electrical leads and an alignment frame to secure add-in boards to the motherboard, reducing EMF discharge and allowing for more flexible board configurations without increasing the device thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If traditional board-to-board connectors are used to connect add-in boards to motherboard, then electrical connection is established, but unwanted EMF discharge occurs and device thickness increases

Engineering Contradiction:
ImproveEMF dischargeVSAvoiddevice thickness
Core Design Contradiction:
Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The connector transitions from a traditional vertical stacking arrangement to an inline horizontal arrangement, changing the dimensional orientation of the connection. This allows the connector to lie substantially in the same plane as the mother board, reducing z-dimension height while maintaining electrical connection functionality

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The connector employs a low-profile design with a conductive case and alignment frame that creates a thin, flexible structure. The lead frame with electrical leads is configured to operate within a constrained thickness, enabling the connector to achieve both EMF shielding and minimal device thickness increase

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If traditional board-to-board connectors are used, then connection is achieved, but manufacturing cost increases and high-volume production becomes difficult

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The connector design integrates multiple functions into a single standardized component: electrical connection through lead frames, mechanical alignment through alignment frames, structural support through conductive cases, and EMF shielding through grounded conductive elements. This multi-functionality in a standardized form factor enables high-volume manufacturing while maintaining reliable connections

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The connector utilizes standard pitch dimensions (e.g., 0.5mm, 1.0mm, 1.27mm, 2.0mm) and conventional lead frame configurations that are compatible with existing manufacturing processes. By adhering to standardized parameters rather than custom designs, the connector achieves reliable electrical connection while being suitable for cost-effective high-volume production

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If add-in boards are connected to motherboard, then system functionality is expanded, but EMF discharge and thermal issues occur

Engineering Contradiction:
Improvesystem functionalityVSAvoidEMF discharge and thermal issues
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The connector acts as an intermediary between the mother board and add-in boards, providing a controlled interface that manages both electrical signals and thermal pathways. The conductive case and aligned lead frames create a structured connection that reduces EMF discharge while maintaining signal integrity, and the mechanical alignment ensures proper thermal contact between components

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP4020717B1Ultra slim module form factor and connector architecture for inline connection
Publication Date: 2024.08.28 INTEL CORP
  • EP4020717B1 patent drawingFigure 1A
  • EP4020717B1 patent drawingFigure 1B
  • EP4020717B1 patent drawingFigure 2A~2C

AI summary

A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while aligned in substantially the same plane with an inline connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.