In-line Coater for Simultaneous Dual-Side Thin Film Deposition
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Solution Overview
Problem
Existing thin film deposition equipment for mass production faces challenges such as low quality of multilayer optical structures, inability to coat both sides of substrates simultaneously, limited processing device usability, and unsuitable dimensions and cost for depositing structures with multiple layers.
Innovation Solution
The proposed in-line coater design includes input and output load-lock chambers, multiple process chambers with processing devices, a pass-through transport system, and a rotatable substrate holder with independent rotation capabilities, allowing for synchronous step-by-step movement and simultaneous coating on both sides of substrates, optimized for vacuum deposition with gas isolation and various processing devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are placed on rotatable cylindrical substrate holders moved along working areas with constant linear and rotation speed, then the coating uniformity is improved, but the equipment cannot simultaneously coat both sides of the substrate
Solution Approach 1:
The substrate holder is divided into two independent rotatable cylinders, each capable of rotating independently. This segmentation allows substrates on one side to be coated while the other side is simultaneously coated by the second cylinder, resolving the contradiction between coating uniformity and the ability to coat both sides simultaneously.
Solution Approach 2:
The invention transitions from a single-plane substrate holder to a dual-plane configuration where substrates are mounted on two opposite faces of the cylindrical holder. This dimensional change enables simultaneous coating of both sides while maintaining the rotational motion required for uniform coating distribution.
2Manufacturing precision
If multiple process chambers are used to deposit structures with tens and hundreds of layers, then the coating quality is improved, but the equipment dimensions and cost increase
Solution Approach 1:
Multiple deposition functions are merged into a single process chamber by incorporating multiple evaporation sources and sputtering targets that can operate simultaneously or sequentially on different sides of the substrate holder. This consolidation maintains high coating quality for multilayer structures while significantly reducing the number of required process chambers and overall equipment dimensions.
Solution Approach 2:
The dual-side substrate holder enables continuous coating operation where while one side is being coated, the other side can be prepared or is already coated. This continuous action allows deposition of tens and hundreds of layers without requiring multiple separate chambers, reducing equipment length while maintaining coating quality.
3Manufacturing precision
If multiple process chambers are used for depositing multilayer structures, then the coating quality is improved, but the equipment cost increases
Solution Approach 1:
Multiple deposition technologies (evaporation and sputtering) and multiple deposition functions are combined within a single process chamber. This merging eliminates the need for multiple expensive process chambers while maintaining the ability to produce high-quality multilayer coatings, thereby reducing overall equipment cost.
Solution Approach 2:
The single process chamber is designed with universal functionality to perform multiple deposition tasks using different methods (evaporation, sputtering) on both sides of the substrate holder. This multi-functionality replaces what would traditionally require multiple specialized chambers, reducing equipment complexity and cost while maintaining coating quality.
4Length of stationary object
If a single process chamber is used, then the equipment dimensions and cost are reduced, but the processing device usability and technology options are limited
Solution Approach 1:
Multiple processing technologies (evaporation sources and sputtering targets) are merged within the single process chamber, allowing diverse coating processes to be performed without requiring multiple chambers. This maintains processing versatility while keeping equipment dimensions compact.
Solution Approach 2:
The dual-side substrate holder configuration enables processing versatility by allowing different treatments on opposite sides of the substrate simultaneously. This dimensional approach provides multiple processing options within a single chamber, maintaining adaptability while reducing equipment size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the quality and uniformity of thin film coatings, increases productivity by enabling simultaneous coating on both sides of substrates, reduces the number of process chambers needed, and minimizes equipment size and cost, making it suitable for mass production of complex coatings.
Implementation Method 1
a rotary-motion feedthrough of the substrate holder disposed in the process chamber comprises a coupling device for coupling the feedthrough with a central shaft of the substrate holder
Implementation Method 2
the transport system is adapted to moving the substrate holder synchronously step-by-step from chamber to chamber in a direction perpendicular to the rotation axis of the substrate holder
Implementation Method 3
processing devices for treating a substrate surface and for depositing thin-films on the substrate surface
Data Source
AI summary
A transport system of the in-line coater moves the substrate holder from chamber to chamber in a direction perpendicular to the axis of its rotation and in each process chamber. The system moves the substrate holder to the working area along its axis of rotation. The process chamber has a cavity the size of which is determined by the dimensions of the substrate holder and is sufficient to place technology devices and monitoring instruments in it. In the first embodiment of the in-line coater, the supporting frame of the transport system on which the substrate holder is cantilevered, is configured to move from the chamber to the chamber both in horizontal and vertical positions. In the second embodiment of the in-line coater the supporting frame is configured to move only in a vertical position, and the in-line coater comprises additionally a substrate holder return chamber.