In-line Connector Stack Testing for Implantable Devices

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Solution Overview

Problem

Existing implantable medical device connectors face challenges in maintaining reliable electrical contact and detachment for implanting, programming, and replacing devices, with prior art connectors not adequately addressing the need for alignment and conductivity testing before installation.

Innovation Solution

The development of in-line connector stacks with an encapsulation layer and snap fit end caps, allowing for alignment and testing of seal and conductive elements before installation, ensuring secure engagement with the header assembly and maintaining electrical communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If in-line connector stacks are encapsulated and tested before installation, then manufacturing precision and reliability are improved, but device complexity and manufacturing time increase

Engineering Contradiction:
Improvealignment precisionVSAvoidconnector stack complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The connector assembly is divided into separate modular components: the in-line connector stack, the encapsulation layer, and the header assembly. This segmentation allows the connector stack to be manufactured and tested independently before final assembly, improving alignment precision while managing complexity through modular design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connector stack is encapsulated in an encapsulation layer and tested for alignment and conductivity before being installed in the header assembly. This preliminary action ensures manufacturing precision is verified early in the process, preventing defects from propagating to later assembly stages.

Inventive Principle:
Principle #10Preliminary action

2Ease of operation

If connector stacks are designed for detachable connections, then ease of operation and maintenance are improved, but reliability of electrical contact may worsen

Engineering Contradiction:
ImprovedetachabilityVSAvoidelectrical contact reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The connector design incorporates dynamic characteristics by allowing the connector stack to be detachably connected to the header assembly. This enables the connection to transition between connected and disconnected states, facilitating ease of operation for implanting, programming, and replacing devices while maintaining reliable electrical contact when connected through proper contact element design.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables reliable and detachable electrical connections for implantable medical devices, facilitating quality control and secure sealing, thereby ensuring consistent performance and ease of maintenance.

Implementation Method 1

a plurality of seal elements and conductive contact elements are located between the two end surfaces

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8328587B2In-line connector stack with testing capability
Publication Date: 2012.12.11 BAL SEAL ENG CO INC
  • US8328587B2 patent drawing
  • US8328587B2 patent drawing
  • US8328587B2 patent drawing

AI summary

Connector assemblies for use with implantable medical devices having easy to assemble contacts are disclosed. The connector assemblies are generally formed by coupling a plurality of ring contacts, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore for receiving a medical lead cable. Contact grooves or spring chambers for positioning the spring contact elements are formed in part by assembling multiple components together. A further aspect is a provision for encasing each connector assembly or stack inside a thermoset layer or a thermoplastic layer before over-molding the same to a sealed housing.