In-line manufacturing apparatus
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Solution Overview
Problem
The temperature increase of substrates during manufacturing processes in in-line manufacturing apparatuses leads to substrate deformation and non-flat surfaces, affecting process accuracy, and complicates chamber maintenance.
Innovation Solution
An in-line manufacturing apparatus with a carrier and adjacent cooling unit that includes a cooling part, such as a pipe or gas injection holes, to maintain substrate temperature and prevent deformation, featuring a movable cooling system that simplifies maintenance by allowing individual repair without affecting the process chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple process chambers are used for sequential manufacturing processes, then manufacturing capability is improved, but substrate temperature increases causing deformation and surface non-flatness
Solution Approach 1:
A cooling part is introduced as an intermediary component between the substrate and the process chambers. This cooling part includes a cooling chamber with cooling holes that allow cooling gas to flow through, acting as a thermal mediator that removes excess heat from the substrate during transport through multiple process chambers, thereby preventing substrate deformation while maintaining manufacturing productivity
Solution Approach 2:
The cooling part performs preliminary cooling action on the substrate before it enters the process chambers and continues cooling during transport. By pre-cooling and continuously cooling the substrate beforehand and during the manufacturing process, the substrate temperature is kept at an appropriate level to prevent deformation and maintain surface flatness throughout the sequential manufacturing processes
2Temperature
If the cooling system is integrated with the carrier, then substrate temperature control is improved, but device complexity increases
Solution Approach 1:
The cooling system is segmented into modular components: a cooling part with a cooling chamber, multiple cooling holes distributed on the carrier, and a cooling gas supply system. This segmentation allows the cooling function to be added to the carrier without requiring complete redesign of the entire system, and enables independent maintenance of individual cooling components, thereby reducing overall device complexity while maintaining effective temperature control
Solution Approach 2:
Cooling gas is introduced as an intermediary medium to transfer thermal energy from the substrate to the cooling part. Instead of direct thermal contact or complex thermal conduction paths, the cooling gas flows through the cooling holes and absorbs heat from the substrate, providing simple and effective temperature control while minimizing structural complexity
3Ease of repair
If the cooling part is made movable with the carrier, then maintenance ease is improved, but reliability may be affected by additional moving components
Solution Approach 1:
The cooling part is merged with the carrier to form an integrated assembly that moves together as a single unit. The cooling part is disposed on the carrier and moves together with the carrier, allowing the entire cooling system to be easily removed and replaced as a single module for maintenance, while the integration reduces the number of separate moving components and connections that could potentially fail, thereby maintaining reliability while improving ease of repair
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate temperature rise, maintains surface flatness, and reduces maintenance complexity by allowing localized cooling and easy repair of the cooling system without disrupting the manufacturing process.
Implementation Method 1
a cooling part disposed adjacent to the carrier and movable with the carrier
Implementation Method 2
cooling water or a cooling gas may be supplied to the pipe
Data Source
AI summary
An in-line manufacturing apparatus includes a carrier that transports a substrate, a plurality of process chambers subjected to a manufacturing process on the substrate transported through the carrier, and a cooling part disposed adjacent to the carrier and movable with the carrier.