Modular Inline Power Module Layout for Low-Inductance Scaling
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Solution Overview
Problem
High power applications require compact, high voltage, high current, and low inductance power modules that can scale to accommodate various power processing needs without compromising performance, but existing solutions struggle to achieve this scalability and modularity while maintaining performance benefits.
Innovation Solution
A power module design featuring a size- and cost-optimized power substrate with a novel layout that allows for the accommodation of larger devices or more devices in parallel, incorporating a scalable and modular package concept that can widen or lengthen to meet power processing demands, with a housing that encompasses power and signal terminals and utilizes bond wires for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a compact power module design is used, then high power density is achieved, but scalability to accommodate larger devices or more devices in parallel is limited
Solution Approach 1:
The power module is divided into modular components including a substrate with device pads, power devices mounted on the substrate, a housing encompassing these components, and terminal assemblies extending from the housing. This segmentation allows the module to be scaled by adding more power devices in parallel while maintaining the same compact structural design, thus achieving both high power density and scalability.
2Quantity of substance
If multiple power devices are arranged in parallel, then current handling capability is improved, but inductance increases
Solution Approach 1:
Multiple power devices are arranged in parallel on a single substrate with shared device pads and terminal connections. This merging approach allows current to be distributed across multiple devices while maintaining a compact current path, thereby improving current handling capability without significantly increasing inductance compared to separate discrete devices.
3Adaptability or versatility
If a modular package concept is used, then adaptability to various power processing needs is improved, but device complexity increases
Solution Approach 1:
The power module employs a universal substrate design with standardized device pads, housing, and terminal assemblies that can accommodate different configurations of power devices. This universal structure allows the same basic module design to be adapted for various power processing applications including three-phase, half-bridge, and full-bridge topologies, improving versatility while keeping the package complexity manageable through standardization.
Data Source
AI summary
A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal.