In-Line SPM Cleaning with Shared Bath for Higher Wafer Throughput
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Solution Overview
Problem
Current sulfuric peroxide mixture (SPM) cleaning processes for substrates after chemical mechanical polishing are inefficient, requiring separate containers for each substrate, leading to high chemical usage and increased costs, and are time-consuming, limiting throughput due to the need for parallel processing of multiple substrates.
Innovation Solution
An in-line SPM processing system that integrates multiple substrates into a single tank, utilizing a robot system and multiple cleaning elements like megasonic cleaners and rotating brushes, allowing for batch mode processing and recirculation of cleaning solutions to reduce chemical usage and processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate containers are used for each substrate in SPM cleaning, then each substrate can be cleaned independently, but chemical consumption increases and processing time increases
Solution Approach 1:
The patent merges multiple separate cleaning containers into a single shared container that can accommodate multiple substrates simultaneously. The SPM cleaning solution is recirculated through a common reservoir and distribution system, allowing multiple substrates to be cleaned in the same chemical bath, thereby reducing chemical consumption while maintaining cleaning effectiveness.
Solution Approach 2:
The cleaning system is designed with a universal container and recirculation system that can handle multiple substrates of different types. The single SPM cleaning solution serves multiple substrates sequentially or simultaneously, making the system multi-functional rather than dedicated to single substrate cleaning.
2Reliability
If separate containers are used for each substrate in SPM cleaning, then each substrate can be cleaned independently, but processing time increases
Solution Approach 1:
Multiple substrate cleaning operations are merged into a single container environment. The recirculation system allows the SPM solution to continuously flow through multiple substrates, enabling parallel or sequential cleaning without the time penalty of transferring substrates between separate containers.
Solution Approach 2:
The SPM cleaning solution is continuously recirculated through the substrates rather than being static. This continuous flow ensures that cleaning action is maintained across multiple substrates without interruption, reducing total processing time compared to batch processing in separate containers.
3Productivity
If multiple substrates are processed in parallel in separate containers, then throughput can be maintained, but system complexity and chemical usage increase
Solution Approach 1:
The patent combines multiple cleaning functions into a single integrated system with one container, recirculation pump, and control system. This reduces the number of separate containers, pumps, and control systems needed, thereby reducing overall system complexity while maintaining the ability to process multiple substrates.
Solution Approach 2:
The single cleaning system is designed to be universal, handling multiple substrates through a common infrastructure. The recirculation system can route the SPM solution to different substrates as needed, providing multi-functionality without requiring separate dedicated systems for each substrate.
4Productivity
If multiple substrates are processed in parallel in separate containers, then throughput can be maintained, but chemical costs increase
Solution Approach 1:
Multiple substrate cleaning operations are combined into a single chemical bath with recirculation. The SPM solution is shared across multiple substrates through continuous circulation, dramatically reducing the total volume of chemicals needed compared to having separate containers for each substrate, thereby reducing chemical costs while maintaining throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The in-line SPM processing system enhances efficiency by reducing chemical consumption, lowering costs, and improving throughput by allowing substrates to be processed in a first-in, first-out mode without compromising overall system performance, thus integrating effectively with CMP systems.
Implementation Method 1
a mixture of sulfuric acid and hydrogen peroxide (SPM) can be used in the removal of cerium oxide particulates from the surfaces of a substrate after polishing
Implementation Method 2
The at least two cleaning elements are selected from the group consisting of a megasonic cleaner
Implementation Method 3
The at least two cleaning elements are selected from the group consisting of a rotating brush cleaner
Data Source
AI summary
A method for removing particulates from a plurality of substrates includes opening a first access port in a top of a first container holding a cleaning fluid bath, inserting a first substrate through the first access port to a first support, closing the first access port, opening a second access port in the top of the first container, inserting a second substrate through the second access port to a second support, closing the second access port, opening the first access port, removing the first substrate through the first access port and delivering the first substrate into a rinsing station, closing the first access port, opening the second access port, removing the second substrate through the second access port and delivering the second substrate into the rinsing station, and closing the second access port.