Inline Wafer Conveyance Device with Belt Mechanism

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Solution Overview

Problem

Conventional inline-type wafer conveyance devices face issues with particle generation due to friction, complex and costly mechanisms, large footprint, and reduced precision and reliability due to buffer chambers and aligners in cluster-type devices.

Innovation Solution

An inline-type wafer conveyance device with a U-shaped or bent structure, eliminating the need for buffer chambers and direct wafer transfers, using a series of connected conveyance chambers and process modules with gate valves for efficient wafer processing and reduced particle generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a conventional inline-type wafer conveyance device uses a rectilinear structure with mobile carriers and rollers, then the device can convey wafers in a compact footprint, but particles are generated due to friction between components

Engineering Contradiction:
ImprovefootprintVSAvoidparticle generation
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The patent removes the mobile carrier and roller components from the wafer conveyance system. Instead of using rollers to move carriers, the invention uses a belt mechanism that directly conveys wafers through the processing chambers, eliminating the friction-based roller-carrier interface that generates particles.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical roller-carrier conveyance system with a belt-driven conveyance system. The belt mechanism provides a different mechanical approach to wafer movement that reduces friction and particle generation compared to the roller-based system.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Adaptability or versatility

If a cluster-type wafer conveyance device is used, then the device can be adapted to facility structures, but the footprint is large and processing speed is slow due to buffer chambers

Engineering Contradiction:
Improvefacility adaptationVSAvoidprocessing speed
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent divides the processing system into multiple independent processing chambers that can be configured in different layouts (rectilinear, U-shaped, L-shaped). Each chamber is self-contained with its own wafer processing capabilities, eliminating the need for large buffer chambers and allowing flexible facility adaptation while maintaining high throughput.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from the radial arrangement of cluster-type devices to multi-dimensional linear arrangements (rectilinear, U-shaped, L-shaped configurations). This dimensional change allows for more efficient wafer flow paths and eliminates the need for buffer chambers, improving processing speed while adapting to facility layouts.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of operation

If buffer chambers and aligners are added to cluster-type devices, then wafer transfer flexibility is improved, but precision and reliability are reduced

Engineering Contradiction:
Improvewafer transfer flexibilityVSAvoidprecision and reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent combines wafer processing and conveyance functions into integrated processing chambers. Each chamber can process wafers and transfer them directly to the next chamber without requiring separate buffer chambers or aligners, maintaining flexibility while improving precision and reliability through direct conveyance.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of operation

If mobile carriers and transfer mechanisms are used in inline-type devices, then the conveyance mechanism is functional, but the structure becomes complicated and expensive

Engineering Contradiction:
Improveconveyance functionalityVSAvoidmechanism complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent removes the mobile carrier component entirely from the system. Wafers are conveyed directly on the belt mechanism without being mounted on separate carriers, and the roller transfer mechanisms are eliminated in favor of direct belt conveyance between chambers, significantly simplifying the overall structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS8092139B2Inline-type wafer conveyance device
Publication Date: 2012.01.10 CANON ANELVA CORP
  • US8092139B2 patent drawing
  • US8092139B2 patent drawing
  • US8092139B2 patent drawing

AI summary

There are comprised a load chamber (51) for carrying in a wafer from outside, an unload chamber (53) for carrying out a wafer to outside, and a plurality of conveyance chambers (54a, 54b, 54c) and a plurality of process modules (52a, 52b) connected in series between the load chamber and the unload chamber. The conveyance chambers and the process modules are connected alternately and the plurality of conveyance chambers includes a first end conveyance chamber (54a) connected to the load chamber, a second end conveyance chamber (54c) connected to the unload chamber, and another one or a plurality of intermediate conveyance chambers (54b).