In-line Wafer Inspection in Semiconductor Processing Chamber

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Solution Overview

Problem

Current semiconductor manufacturing processes require separate inspection apparatuses, leading to increased processing time, footprint, and reduced throughput due to the need for wafer transfer between manufacturing and inspection systems.

Innovation Solution

Integration of a semiconductor wafer in-line metrology module above the input/output chamber in the manufacturing apparatus, allowing for in-situ inspection of processed wafers while pressure changes from vacuum to atmospheric, eliminating the need for additional equipment and reducing processing time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a separate semiconductor inspection apparatus is used, then inspection can be performed, but the throughput is reduced and footprint is increased due to wafer transfer requirements

Engineering Contradiction:

Improveinspection capabilityVSAvoidthroughput

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The patent combines the inspection apparatus with the semiconductor manufacturing apparatus by installing an inspection chamber within the manufacturing apparatus itself. This allows wafers to be inspected in-situ without transfer to a separate inspection device, thereby maintaining high throughput while enabling inspection functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The manufacturing apparatus is designed to serve multiple functions: both processing wafers in the reaction chamber and inspecting them in the integrated inspection chamber. This multi-functionality eliminates the need for separate dedicated inspection equipment, improving throughput without sacrificing inspection capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Measurement precision

If a separate semiconductor inspection apparatus is used, then inspection can be performed, but the footprint is increased

Engineering Contradiction:

Improveinspection capabilityVSAvoidfootprint

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The inspection chamber is merged with the manufacturing apparatus structure, sharing the same physical space and infrastructure. This integration allows the inspection functionality to be added without requiring additional floor space, thus maintaining a compact footprint while enabling inspection.

Inventive Principle:

Principle #5Merging (Combining)

3Measurement precision

If wafers are transferred to a separate inspection chamber, then inspection can be performed, but the processing time is increased

Engineering Contradiction:

Improveinspection capabilityVSAvoidprocessing time

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The inspection is performed in-situ within the manufacturing apparatus before the wafer leaves the processing environment. This preliminary inspection action eliminates the need for subsequent transfer and re-positioning operations, reducing overall processing time while maintaining inspection capability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The inspection process is integrated into the continuous workflow of the manufacturing apparatus. Wafers move seamlessly from processing to inspection within the same chamber without interruption or transfer, maintaining continuous useful action and minimizing time loss.

Inventive Principle:

Principle #20Continuity of useful action

4Productivity

If an inspection chamber is added to the manufacturing apparatus, then throughput is improved, but the footprint is increased

Engineering Contradiction:

ImprovethroughputVSAvoidfootprint

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The inspection chamber is nested within the existing manufacturing apparatus structure, utilizing the available internal space. This nesting approach allows the addition of inspection functionality without proportionally increasing the external footprint, as the inspection components are housed within the existing apparatus boundaries.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS7832353B2Semiconductor manufacturing apparatus equipped with wafer inspection device and inspection techniques

Publication Date: 2010.11.16 ASM JAPAN

AI summary

A semiconductor manufacturing apparatus includes a processing unit for processing at least one wafer; a loading/unloading unit for loading/unloading at least wafer; an input/output chamber for taking in a processed wafer from the processing unit and taking out the processed wafer to the loading/unloading unit, and taking in a unprocessed wafer from the loading/unloading unit and taking out the unprocessed wafer to the reaction unit; and a wafer inspection device for inspecting the processed wafer through a light transmittable top portion of the input/output chamber, through which light is transmittable, while the processed wafer is temporarily placed in the input/output chamber.