In-Mold Touch Module Integrating Flexible Circuit
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Solution Overview
Problem
The existing in-mould injecting technology is not adapted for manufacturing touch panels, leading to complex processes, ladder-like thickness, and dust accumulation due to gaps in joint surfaces when integrating flexible printed circuits with casings for touch control.
Innovation Solution
An in-mould molding touch module that integrates a flexible printed circuit with a touch control circuit within a molding flexible film, using an in-mould injecting mode, where the flexible film has an outer surface for touch control and an inner surface for support, eliminating the need for pre-molded cavities and reducing thickness and dust accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flexible printed circuits are attached in a pre-molded cavity of the casing, then the touch control function is achieved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent combines the flexible printed circuit with the casing into a single integrated structure through in-mold labeling technology. The FPC is inserted into the mold cavity before injection molding, allowing the casing to be formed directly around the FPC in one process step, eliminating separate attachment operations and reducing manufacturing complexity while maintaining touch control functionality
2Reliability
If flexible printed circuits are attached in a pre-molded cavity of the casing, then the touch control function is achieved, but ladderlike thickness and gaps at joint surfaces occur
Solution Approach 1:
By integrating the FPC attachment process into the casing molding process itself, the patent eliminates the interface between separate components. The casing is molded directly around the FPC, creating a seamless structure without joint surfaces or gaps, and ensuring uniform thickness distribution throughout the assembly
3Reliability
If conventional attachment methods are used for flexible printed circuits, then touch control is enabled, but gaps at joint surfaces allow dust accumulation
Solution Approach 1:
The patent creates a seamless integration where the casing is molded directly around the FPC without any joint surfaces or gaps. This eliminates the interfaces where dust could accumulate, while the FPC remains fully functional for touch control operations
4Device complexity
If in-mould injecting technology is applied to touch panels, then process simplification and thickness reduction are achieved, but the technology must be adapted from antenna manufacturing
Solution Approach 1:
The patent demonstrates the universal applicability of in-mold labeling technology by adapting it from antenna manufacturing to touch panel production. The same basic principle of inserting a component into the mold cavity before injection molding is applied, but modified to accommodate FPCs with touch control circuits instead of antenna elements, showing the technology's versatility across different product types
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the manufacturing process, reduces thickness, and prevents dust accumulation by integrating the flexible printed circuit within a flexible film, enabling a thin, efficient, and dust-free touch module for electronic products.
Implementation Method 1
a molding flexible film containing integratedly the flexible printed circuit by an in-mould injecting mode
Data Source
AI summary
An in-mould molding touch module includes a flexible printed circuit having a touch control circuit, and a molding flexible film. The flexible film contains integratedly the flexible printed circuit by an in-mould injecting mode. The flexible film has an outer surface for touch control. The outer surface is configured for being pressed for driving the touch control circuit of the flexible printed circuit to output signals. Therefore, the present touch module is manufactured simply, and has a thin thickness.