In-Mould Touch Module with Integrated ITO Circuit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current technologies do not effectively utilize in-mould injecting technology to manufacture touch panels with integrated sensing circuits, particularly lacking methods for producing touch panels with both inducing capacitive and press touch capabilities using indium tin oxide (ITO) and conductive printing ink within a single module.
Innovation Solution
An in-mould molding touch module is created using a plastic film with integrated touch circuits, where the inner surface is coated with ITO or conductive printing ink and injected with molding material to form a one-piece body, eliminating gaps and dust accumulation, and allowing for thin, efficient touch panel production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If in-mould injecting technology is used to manufacture touch panels with integrated sensing circuits, then manufacturing efficiency and integration are improved, but the technology is not yet developed or standardized for this application
Solution Approach 1:
The touch panel assembly including substrate, touch sensing circuit, and carrier is prepared in advance before the in-mould injecting process. This preliminary preparation allows the injecting technology to be applied directly to pre-assembled components, improving manufacturing efficiency while managing the complexity of the technology through staged implementation
Solution Approach 2:
The invention merges the touch panel assembly with the molding process by integrating the sensing circuit and carrier into a single in-mould injecting operation. This combining of multiple manufacturing steps into one process improves productivity while the standardized integration method addresses the technology maturity challenge
2Device complexity
If traditional multi-layer assembly methods are used for touch panels, then manufacturing flexibility is maintained, but the panel thickness increases and gaps between joint surfaces create dust accumulation
Solution Approach 1:
The invention merges multiple layers (substrate, touch sensing circuit, carrier) into a single integrated structure through in-mould injecting. This eliminates gaps between joint surfaces that would otherwise accumulate dust, while the one-piece body maintains manufacturing flexibility by allowing different material compositions and circuit configurations within the unified structure
Solution Approach 2:
The use of thin film materials for the substrate and carrier in the in-mould injecting process enables the production of ultra-thin touch panels. The flexible nature of these thin films allows them to be integrated into the molding process without compromising manufacturing flexibility, while significantly reducing overall panel thickness compared to traditional multi-layer assemblies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of thin, dust-resistant touch panels with integrated capacitive and press touch capabilities, simplifying manufacturing and reducing thickness, while maintaining heat resistance and auto-producing capabilities.
Implementation Method 1
inserting the plastic film having the inducing capacitive touch circuit coated thereon into a cavity of an injecting device, and injecting molding material into the cavity to form a molding rind integrated with the inner surface
Implementation Method 2
coating an ITO layer on the inner surface in the touch area by a vacuum sputtering mode
Data Source
AI summary
An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.