Multi-Turn Inner Lead Layout for High-Density Semiconductor Packaging

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Solution Overview

Problem

Existing semiconductor packages face limitations in wiring flexibility and density due to fixed correspondence between outer and inner leads, making it difficult to accommodate semiconductor chips with high-density terminals.

Innovation Solution

A semiconductor package design featuring a bed portion with inner leads formed in multiple turns around the periphery, allowing for flexible wiring connections and arrangements, including spiral shapes and island portions, to increase the degree of freedom in wiring and accommodate high-density terminal configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a large number of wirings are provided with fixed 1:1 correspondence between outer leads and inner leads, then the wiring arrangement is simplified, but the degree of freedom in wiring is narrowed making it difficult to cope with high-density terminals

Engineering Contradiction:

Improvewiring arrangement complexityVSAvoiddegree of freedom in wiring

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The inner leads are segmented into multiple independent leads arranged side by side, allowing each lead to be independently connected to different terminals on the semiconductor chip. This segmentation enables flexible wiring arrangements while maintaining manageable complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The inner leads are arranged in a planar array side by side, transitioning from a single-column arrangement to a two-dimensional layout. This dimensional change provides multiple connection paths and increases the degree of freedom in wiring arrangement.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If cross bonding is performed to change the arrangement of connection wirings, then the terminal position flexibility is improved, but the bonding wire length becomes long causing wires to contact each other or the semiconductor chip

Engineering Contradiction:

Improveterminal position flexibilityVSAvoidwire contact with chip or other wires

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

Multiple inner leads are provided side by side, allowing direct connections to be made from different terminals to different inner leads without requiring long cross-bonding wires. This segmentation eliminates the need for lengthy wire routes that would cause contact issues.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The multiple inner leads act as intermediaries between the outer leads and the semiconductor chip terminals, providing direct connection paths that eliminate the need for long bonding wires and prevent wire contact problems.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20240170388A1Semiconductor package

Publication Date: 2024.05.23 SONY SEMICON SOLUTIONS CORP

AI summary

Provided is a semiconductor package that increases the degree of freedom in wiring arrangement and enables wiring layout of various bonding wires. The semiconductor package includes: a package main body portion; a bed portion which is provided on a center side of the package main body portion and on which a semiconductor chip is mounted; and an inner lead portion formed in a plurality of turns to surround a periphery of an outer edge side of the bed portion, the inner lead portion establishing connection with the semiconductor chip.