Heat Conduction Device With Inner Loop Resolving Fluid Flow Conflict
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Solution Overview
Problem
Existing heat conduction elements, such as vapor chambers and heat pipes, face inefficiencies due to the conflict between the flowing directions of vaporized and condensed working fluids at the end port, leading to reduced heat exchange efficiency and potential dry burning of the vapor chamber.
Innovation Solution
A heat conduction device with an inner loop is designed, featuring a vapor chamber and heat pipes with an outer and inner pipe configuration, where the inner pipe communicates with the vapor chamber and outer pipe, forming a gap that allows smooth circulation of the working fluid without interference between vaporized and condensed phases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the heat pipe and vapor chamber communicate through the end port only, then the structure is simple, but the vaporized working fluid and condensed working fluid conflict with each other reducing heat exchange efficiency
Solution Approach 1:
The heat pipe is divided into an outer pipe and an inner pipe, creating separate flow paths. The inner pipe handles vaporized working fluid flow from the vapor chamber, while the outer pipe handles condensed working fluid return, eliminating flow conflict and improving heat exchange efficiency while maintaining reasonable structural complexity
Solution Approach 2:
The inner pipe is nested within the outer pipe, forming a concentric dual-pipe structure. This nesting arrangement allows independent flow channels for vapor and liquid phases, enabling efficient heat exchange without requiring a completely separate external return path
2Reliability
If the vaporized and condensed working fluid flow in opposite directions through the same end port, then the structure is compact, but the heat exchange efficiency is affected due to flow conflict
Solution Approach 1:
The single end port communication is segmented into two separate communication paths: the inner pipe for vapor flow and the outer pipe for liquid return flow. This segmentation resolves the flow conflict issue while adding only moderate structural complexity through the dual-pipe configuration
3Reliability
If the liquid-state working fluid cannot flow back into the vapor chamber, then the structure is simple, but dry burning of the vapor chamber occurs reducing heat conduction performance
Solution Approach 1:
The nested dual-pipe structure provides a dedicated outer pipe pathway for liquid-state working fluid to flow back from the heat pipe to the vapor chamber, ensuring continuous replenishment of the working fluid and preventing dry burning, while maintaining a compact and relatively simple overall structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures efficient heat exchange by preventing conflicts between fluid phases, maintaining fluid circulation, and preventing dry burning, thereby enhancing the heat conduction and exchange performance.
Implementation Method 1
cause the working fluid to generate a vapor-liquid phase transition by heating or condensing
Implementation Method 2
heat conduction device with an inner loop... heat conduction and heat exchange performance
Data Source
AI summary
A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.