LED Lighting With Inner and Outer Heat Sinks of Different Conductivity
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Solution Overview
Problem
Existing LED lighting devices face challenges in efficiently managing heat dissipation and electrical isolation of components, which can affect performance and reliability, particularly in high-power applications.
Innovation Solution
The lighting device incorporates a dual heat sink system with a thermally conductive module heat sink and a less conductive housing heat sink, along with an insulating layer to isolate electrical components, and a capacitive coupling mechanism for the antenna, enhancing heat dissipation and reducing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single heat sink is used for thermal management, then the structure is simple, but heat dissipation efficiency is insufficient for high-power LED applications
Solution Approach 1:
The patent divides the heat sink into two separate components: a module heat sink coupled to the LED emitter module and a housing heat sink integrated into the lamp housing. Each heat sink serves a specific thermal management function, with the module heat sink providing localized cooling and the housing heat sink providing overall thermal dissipation, thereby improving heat dissipation efficiency without excessive complexity
Solution Approach 2:
The module heat sink is nested within the housing heat sink structure, creating a hierarchical thermal management system where the smaller module heat sink is positioned inside the larger housing heat sink, allowing efficient heat transfer from the LED emitter through multiple thermal pathways
2Volume of moving object
If electrical components are placed close to the heat sink for compact design, then device size is reduced, but electrical isolation becomes difficult
Solution Approach 1:
The patent introduces an electrically insulating material positioned between the module heat sink and the module carrier board, serving as an intermediary that provides electrical isolation while allowing thermal coupling. This enables compact component placement without compromising electrical safety or reliability
Solution Approach 2:
The insulating material is applied locally at specific interfaces where electrical isolation is needed, rather than throughout the entire structure. This selective application maintains compact dimensions while providing electrical isolation precisely where required between conductive components
3Reliability
If traditional antenna coupling methods are used, then the antenna structure is simple, but electromagnetic interference affects signal integrity
Solution Approach 1:
The module heat sink serves as a capacitive coupling intermediary between the antenna and the module carrier board, replacing traditional direct electrical connections. This capacitive coupling mechanism reduces electromagnetic interference and improves signal integrity while maintaining a relatively simple overall structure
Solution Approach 2:
The patent replaces traditional mechanical/electrical antenna coupling methods with a capacitive coupling system that uses the heat sink as a coupling element. This substitution reduces electromagnetic interference and improves signal integrity without requiring complex additional components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages heat and minimizes electrical interference, improving the performance and reliability of LED lighting devices by ensuring efficient thermal management and signal integrity.
Implementation Method 1
a module heat sink that may be thermally coupled to the emitter module
Implementation Method 2
a housing heat sink that may be configured to be thermally coupled to the light-generation module
Implementation Method 3
a housing heat sink that may be configured to be thermally coupled to the light-generation module
Implementation Method 4
an electrically insulating material that may be positioned between the module heat sink and the module carrier board
Implementation Method 5
a capacitive coupling mechanism for the antenna
Data Source
AI summary
A lighting device (e.g., a controllable light-emitting diode illumination device) may have a light-generation module that may be assembled and calibrated prior to the light-generation module being installed in a finished good. The light-generation module may include an emitter module having at least one emitter mounted to a substrate and configured to emit light. The light-generation module may include a first printed circuit board on which the emitter module may be mounted and a second printed circuit board on which those circuits that are essential for powering the emitter module may be mounted. The light-generation module may include a heat sink located between the first printed circuit board and the second printed circuit board. The emitter module may be thermally-coupled to the heat sink through the substrate and the first printed circuit board.