Package-in-Package Inner Stacking Module Cantilevered Interconnect
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Solution Overview
Problem
Current electronics packaging technologies face challenges in accommodating high-speed devices exceeding one TeraHertz, with limitations in cooling, reliability, and cost-effectiveness, while also struggling to meet the demands of precision, ultra-miniature form factors and increasing complexity in manufacturing portable electronics.
Innovation Solution
An integrated circuit package-in-package system is developed, utilizing a substrate with electrical interconnects to support an inner stacking module cantilevered over the substrate, forming a controlled gap, and encapsulating the structure with an encapsulation material to enhance mechanical protection and data flow automation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If current packaging technologies are used for high-speed devices exceeding one TeraHertz, then device speed is improved, but cooling capability and reliability deteriorate
Solution Approach 1:
The patent implements a package-in-package structure where an inner stacking module is nested within an outer package. The inner module contains high-speed devices exceeding one TeraHertz, while the outer package provides enhanced cooling capabilities through dedicated heat dissipation structures. This nesting approach allows the high-speed inner module to benefit from the cooling infrastructure of the outer package, resolving the contradiction between achieving high device speed and maintaining adequate cooling and reliability.
Solution Approach 2:
The packaging system is segmented into distinct functional modules: an inner stacking module for high-speed devices and an outer package for cooling and structural support. This segmentation allows each module to be optimized independently - the inner module for maximum speed performance and the outer package for thermal management - thereby resolving the contradiction between speed and cooling capability.
2Volume of moving object
If precision, ultra-miniature form factors are pursued, then device miniaturization is improved, but manufacturing complexity and automation requirements increase
Solution Approach 1:
The ultra-miniature package is segmented into modular components that can be manufactured separately and assembled through automated processes. The inner stacking module and outer package are distinct units that can be produced using standardized manufacturing techniques, reducing overall manufacturing complexity despite the miniaturized form factor.
Solution Approach 2:
The nested package-in-package structure allows for efficient space utilization in ultra-miniature form factors. By nesting the inner module within the outer package, the design achieves compact dimensions while maintaining separate manufacturing processes for each module, thereby reducing the automation complexity that would otherwise be required for integrated miniaturized manufacturing.
3Productivity
If multiple manufacturing process steps are combined, then productivity is improved, but manufacturing precision and yield control become more challenging
Solution Approach 1:
The manufacturing process is segmented into distinct stages for the inner module and outer package, with clear separation points that allow for independent quality control and yield management. This segmentation enables combination of multiple process steps within each module while maintaining precision control through modular assembly, thereby improving productivity without sacrificing yield control.
Data Source
AI summary
An integrated circuit package-in-package system including: providing a substrate; mounting a structure over the substrate; supporting an inner stacking module cantilevered over the substrate by an electrical interconnect connected to the substrate, the electrical interconnect forming a gap between the inner stacking module and the structure controlled by the size of the electrical interconnect; and encapsulating the structure and inner stacking module with an encapsulation.