Inner Stacking Module Protrusion for IC Packaging Warpage Control
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in accommodating high-speed devices exceeding one TeraHertz, with limitations in cooling, reliability, and cost-effectiveness, as well as increased complexity leading to manufacturing errors and high production costs.
Innovation Solution
The introduction of an inner stacking module with a protrusion surface that allows for conventional molding techniques, providing structural reinforcement, reducing warpage, and enabling more reliable connections and cost-effective production by using the protrusions as stiffeners and solder ball standoffs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional packaging technologies are used for high-speed devices exceeding one TeraHertz, then device functionality is achieved, but cooling efficiency and reliability deteriorate
Solution Approach 1:
The packaging system is divided into multiple segments including an inner stacking module encapsulation with protrusions, an outer encapsulation, and distinct functional zones. The inner stacking module protrusions create separate regions that facilitate better thermal management and structural support, improving reliability for high-speed devices.
Solution Approach 2:
The inner stacking module encapsulation protrusions extend vertically from the encapsulation surface, adding a dimensional feature that creates standoff heights for solder balls and improves thermal pathways without increasing the horizontal footprint of the device.
2Adaptability or versatility
If packaging complexity is increased to accommodate advanced functionality, then device performance is improved, but manufacturing error risk and production cost increase
Solution Approach 1:
The inner stacking module encapsulation protrusions serve multiple functions simultaneously: they provide structural reinforcement to prevent warpage, act as stiffeners for the encapsulation material, create standoff heights for solder ball positioning, and define cavities for component placement. This multi-functionality reduces the need for additional separate structural elements, thereby managing complexity while enhancing adaptability.
3Stability of the object's composition
If structural reinforcement is added to reduce warpage, then packaging stability is improved, but manufacturing complexity increases
Solution Approach 1:
The structural reinforcement features are merged directly into the inner stacking module encapsulation structure itself, rather than being added as separate components. The protrusions are formed as integral parts of the encapsulation material, combining the encapsulation function with the structural reinforcement function in a single manufacturing step, thus improving stability without significantly increasing manufacturing complexity.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing an inner stacking module die; encapsulating the inner stacking module die with an inner stacking module encapsulation to form an inner stacking module, the inner stacking module encapsulation having an inner stacking module protrusion having a planar protrusion surface; and encapsulating at least part of the inner stacking module encapsulation with an encapsulation having a flat top coplanar with the planar protrusion surface or fully encapsulating the inner stacking module encapsulation.