Inorganic Adhesive Composition for OLED Hermetic Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional hermetic sealing methods for OLEDs using glass frit paste face challenges such as inadequate adhesive strength between glass and metal, and the emission of toxic substances during the binder burn-out process, due to a mismatch in thermal expansion coefficients and the use of organic solvents.
Innovation Solution
An inorganic adhesive composition comprising a diluted solution of water glass, fire-resistant inorganic fillers, and black pigment, which is applied to substrates and bonded using laser irradiation, eliminating the need for organic binders and achieving improved adhesive strength and thermal expansion matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If glass frit paste with organic binder is used for sealing, then sealing process can be completed, but toxic substances are emitted during binder burn-out
Solution Approach 1:
The patent removes the organic binder component from the glass frit paste formulation, extracting the harmful element that causes toxic emissions during burn-out. The sealing process is redesigned to function without organic binders, using only inorganic materials that do not release toxic substances when heated.
Solution Approach 2:
The patent changes the chemical composition parameters of the sealing material by replacing organic binder components with inorganic alternatives. This parameter change eliminates the burn-out process and associated toxic emissions while maintaining the sealing functionality through inorganic material properties.
2Ease of manufacture
If conventional glass composition is used, then sealing can be achieved, but adhesive strength between glass and metal is insufficient
Solution Approach 1:
The patent creates a composite sealing material combining glass frit particles with metal oxide powders (such as Fe2O3, CuO, MnO2) that have different thermal expansion coefficients. This composite structure provides both sealing capability and improved adhesive strength to metal substrates through the metal oxide components.
Solution Approach 2:
The patent modifies the local chemical composition of the sealing material by incorporating metal oxide particles specifically at interfaces where adhesion to metal is needed. This localized compositional adjustment enhances adhesive strength at critical interfaces while maintaining overall sealing integrity.
3Ease of manufacture
If glass composition is produced by melting and pulverizing, then glass powder can be obtained, but thermal expansion coefficient does not match frontal or posterior glass
Solution Approach 1:
The patent adjusts the chemical composition parameters of the glass frit by incorporating specific metal oxides (Fe2O3, CuO, MnO2) in controlled amounts. This compositional parameter change modifies the thermal expansion coefficient to match that of the frontal and posterior glass, preventing stress due to thermal expansion mismatch.
Solution Approach 2:
The patent introduces metal oxide particles with specific thermal expansion properties into the glass matrix locally, creating regions that match the thermal expansion characteristics of adjacent glass components. This localized compositional adjustment ensures thermal compatibility at interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents toxic substance emission, enhances adhesive strength through efficient laser heating, and improves working efficiency by controlling viscosity, while maintaining hermetic sealing effectiveness.
Implementation Method 1
heat the inorganic adhesive composition by laser irradiation
Implementation Method 2
black pigment... improves adhesive strength by increasing heating efficiency using laser
Implementation Method 3
diluted solution of water glass... adhesive strength is improved
Data Source
AI summary
The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.