Inorganic Adhesive Layers for Flexible OLED Displays
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Solution Overview
Problem
The use of resin adhesives in organic light emitting display devices compromises the bending characteristics and temperature stability, making it challenging to implement flexible displays effectively.
Innovation Solution
The implementation of metal or inorganic/semiconductor material layers as adhesives instead of resin to attach functional films to the display panel, enhancing the bending and temperature stability, and improving moisture permeability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If resin adhesive is used to attach functional film, then adhesive bonding is achieved, but bending characteristic is lowered due to increased thickness
Solution Approach 1:
The adhesive layer transitions from a resin-based material with micrometer-scale thickness to a metal or inorganic layer with nanometer-scale thickness. This parameter change in material composition and thickness enables maintaining adhesive strength while significantly reducing the overall thickness that would impede bending characteristics.
Solution Approach 2:
The patent employs composite structures where metal layers or inorganic layers are combined with the functional film and display panel. These composite materials provide both the necessary adhesive bonding properties and the thin profile required for flexible bending, overcoming the limitations of single-material resin adhesives.
2Strength
If resin adhesive is used to attach functional film, then adhesive bonding is achieved, but temperature stability is compromised
Solution Approach 1:
The adhesive material undergoes a fundamental parameter change from organic resin to inorganic metal or ceramic materials. This transformation provides superior thermal stability and compositional stability across temperature variations, eliminating the temperature-sensitive characteristics of resin adhesives while maintaining effective bonding.
3Length of moving object
If metal layer or inorganic layer is used as adhesive, then bending and temperature characteristics are improved, but manufacturing process complexity increases
Solution Approach 1:
The manufacturing process replaces traditional mechanical adhesive application methods with physical vapor deposition techniques such as sputtering. This substitution enables precise control of thin layer thickness and composition while automating the process, ultimately reducing overall manufacturing complexity despite introducing advanced deposition equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a slimmer, more flexible organic light emitting display device with improved bending and temperature characteristics, simplifying the structure and reducing costs while maintaining high performance.
Implementation Method 1
the functional film and the window are formed by deposition
Implementation Method 2
The surface processing may be performed by any one method of a plasma processing
Data Source
AI summary
An organic light emitting display device having a display substrate; a display element layer formed on the display substrate and including a plurality of pixels, a thin film encapsulation layer which covers and protects the display substrate and the display element layer; a function film disposed on the thin film encapsulation layer, a first adhesive layer disposed between the thin film encapsulation layer and the functional film, a window attached onto the functional film which protects the display element layer, and a second adhesive layer disposed between the functional film and the window, in which the first adhesive layer and the second adhesive are formed by deposition, a surface processing is performed, and facing surfaces are adhered with each other.