Inorganic Core Package Substrate for Warpage-Resistant Fine Routing
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Solution Overview
Problem
The increasing performance demands for high performance computing (HPC) chips and integrated circuit (IC) chips lead to challenges in package design, manufacturing, and reliability, including warpage, lower assembly yield, and the need for external stiffeners and carrier substrates.
Innovation Solution
The development of an improved package substrate with an inorganic core body, embedded capacitors, and built-up redistribution layers directly on the core body, which provides fine routing capability, increased stiffness to minimize warpage, and enhanced thermal performance, eliminating the need for a carrier interposer and stiffeners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic substrates are used in package assemblies, then ease of manufacture is improved, but stiffness is reduced leading to higher warpage
Solution Approach 1:
The patent uses a composite substrate structure combining an organic substrate layer with an inorganic stiffening layer (such as ceramic or glass). This composite structure maintains the manufacturing advantages of organic substrates while adding the stiffness and dimensional stability of inorganic materials to reduce warpage.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the substrate by incorporating materials with different thermal expansion coefficients and mechanical properties. The inorganic stiffening layer has higher modulus of elasticity and lower thermal expansion, which compensates for the organic substrate's tendency to warp under thermal stress.
2Adaptability or versatility
If discrete interposers and carrier substrates are used, then routing capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of the organic substrate, inorganic stiffening layer, and carrier substrate into a single integrated substrate assembly. The inorganic layer is formed directly on the organic substrate, eliminating the need for separate discrete interposers and reducing the number of assembly steps.
Solution Approach 2:
The inorganic stiffening layer serves multiple functions simultaneously: it provides mechanical stiffness to reduce warpage, acts as a carrier substrate for mounting chips, and provides fine routing capability through its metal interconnect structure. This multi-functionality eliminates the need for separate specialized components.
3Stability of the object's composition
If stiffeners are added to control warpage, then warpage control is improved, but space availability is reduced
Solution Approach 1:
The inorganic stiffening layer is applied selectively to specific regions of the organic substrate where stiffness is most needed, such as under chip mounting areas or along support ribs. This localized approach provides warpage control while minimizing the use of space that would otherwise be available for other components.
Data Source
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AI summary
A package substrate for a microelectronic package assembly includes an inorganic core body, such as a ceramic core body, with embedded capacitors and at least one conductive through via extending through the core body. The structure of the inorganic core body allows for at least one redistribution layer to be built-up directly onto the inorganic core body, without the use of an intermediate carrier or interposer.