Inorganic Electrode Transfer to Bendable Polymer Substrates

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Solution Overview

Problem

Conventional flexible electronic devices using organic conductive materials on polymer substrates fail to meet requirements of flexibility, electrical properties, and durability due to the inability to directly form inorganic conductive materials on these substrates, as they cannot withstand high temperature processes.

Innovation Solution

A method is developed to transfer inorganic one-dimensional conductive materials like carbon nanotubes or nanofibers onto a bendable polymer substrate using screen printing and a polymer layer, ensuring the inorganic electrode structure maintains electrical properties and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If inorganic conductive materials are directly formed on polymer substrate by high temperature process, then electrical properties and durability are improved, but the polymer substrate cannot withstand the high temperature and is damaged

Engineering Contradiction:

Improveelectrical properties and durabilityVSAvoidhigh temperature process

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent divides the formation process into two separate stages: first forming the inorganic conductive material pattern on a hard substrate at high temperature, then transferring it to the flexible polymer substrate at low temperature. This segmentation allows the high temperature process to occur without exposing the polymer substrate to damaging temperatures.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The inorganic conductive material pattern is formed in advance on a hard substrate before the polymer substrate is introduced. This preliminary action enables the high temperature processing to be completed while the polymer substrate remains intact, and the pre-formed pattern is subsequently transferred to the flexible substrate.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 3:

A hard substrate serves as an intermediary carrier that temporarily holds the inorganic conductive material pattern during high temperature formation. This intermediary allows the pattern to be created under conditions suitable for inorganic materials, then transferred to the polymer substrate that cannot withstand such conditions.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If organic conductive materials are used on polymer substrate, then flexibility is maintained, but electrical properties and stability are insufficient

Engineering Contradiction:

Improveelectrical properties and stabilityVSAvoidtransfer process complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The hard substrate acts as an intermediary that enables the use of superior inorganic conductive materials on flexible polymer substrates. This intermediary approach allows the system to achieve the electrical properties of inorganic materials while maintaining the flexibility of organic substrates, despite adding transfer process steps.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS7679081B2Substrate structures and fabrication methods thereof

Publication Date: 2010.03.16 HANNSTAR DISPLAY CORP

AI summary

Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).