Inorganic Interlayer for Copper Resist Patterning

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Solution Overview

Problem

The challenge is to form a resist pattern on a copper-coated support with high accuracy, as existing methods using chemically amplified type resist compositions often result in defects like film stripping or dropping, and require strict control of conditions for organic shielding layers, which can lead to mixing issues.

Innovation Solution

A process involving lamination of a copper-coated support with an inorganic substance layer and a chemically amplified type positive photoresist layer, followed by selective irradiation and development, to reduce copper's influence and prevent mixing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If a chemically amplified type resist composition is used on a copper-coated support, then photosensitivity is improved, but resist pattern accuracy deteriorates due to film stripping or dropping

Engineering Contradiction:

ImprovephotosensitivityVSAvoidresist pattern accuracy

Core Design Contradiction:

Use of energy by moving objectVSManufacturing precision

Solution Approach 1:

An inorganic substance layer is introduced as an intermediary between the copper-coated support and the chemically amplified type photoresist layer. This intermediate layer prevents direct harmful interaction between the copper support and the photoresist, thereby maintaining high photosensitivity while preventing film stripping or dropping that would compromise pattern accuracy.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a composite structure consisting of multiple layers: copper-coated support, inorganic substance layer, and chemically amplified type photoresist layer. This composite material approach allows each layer to contribute its specific properties - the copper provides structural support, the inorganic layer provides protective interface, and the photoresist provides high sensitivity patterning capability.

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If an organic shielding layer is used to prevent copper contact, then resist pattern accuracy is improved, but production control complexity increases due to strict management requirements

Engineering Contradiction:

Improveresist pattern accuracyVSAvoidproduction control complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the material parameter of the shielding layer from organic to inorganic substance. This parameter change fundamentally alters the layer's properties - inorganic layers provide better thermal stability, chemical inertness, and easier process control compared to organic materials, thereby reducing production control complexity while maintaining pattern accuracy.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The inorganic substance layer serves as a disposable intermediate layer that is removed together with the photoresist layer during development. This eliminates the need for separate removal steps and simplifies production control, as the shielding layer is temporarily present only during the critical patterning phase.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Object-affected harmful factors

If an organic shielding layer is used, then copper contact is prevented, but mixing between shielding layer and photoresist layer occurs

Engineering Contradiction:

Improvecopper contact preventionVSAvoidlayer mixing

Core Design Contradiction:

Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The patent changes the material composition parameter of the shielding layer from organic to inorganic substance. This parameter change creates better chemical compatibility and interfacial stability between the shielding layer and the photoresist layer, preventing mixing while still effectively preventing copper contact during the patterning process.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This process enables the formation of a resist pattern with reduced copper effects, stable production, and minimal mixing issues, allowing for easy control and management, while maintaining the accuracy and stability of the resist pattern.

Implementation Method 1

an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source is laminated between the support and the photoresist layer

Methodology Applied

Scientific EffectPhysical barrier effect:

Implementation Method 2

a chemically amplified type resist composition using an acid generator is well known as a highly sensitive photosensitive resin composition. In the chemically amplified type resist composition, an acid is generated from the acid generator by irradiation with radioactive rays

Methodology Applied

Scientific EffectChemical amplification:

Implementation Method 3

selectively irradiating active light or radioactive rays to said photoresist laminate

Methodology Applied

Scientific EffectPhotoirradiation:

Implementation Method 4

developing said photoresist layer together with said inorganic substance layer to form a resist pattern

Methodology Applied

Scientific EffectAlkali dissolution:

Data Source

PatentUS7754416B2Process for producing resist pattern and conductor pattern

Publication Date: 2010.07.13 TOKYO OHKA KOGYO CO LTD

AI summary

This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type positive photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to said photoresist laminate, and the step of developing said (c) photoresist layer together with said (b) inorganic substance layer to form a resist pattern.