Inorganic LED Panel Single-Layer Wiring for Heat and Uniformity

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Solution Overview

Problem

The existing LED light boards for liquid crystal display devices require multiple metal layers or numerous jumper resistors for electrical interconnection, leading to high costs and poor heat dissipation, as well as potential adverse effects on light uniformity.

Innovation Solution

A light-emitting panel design using inorganic light-emitting diodes with two first pins arranged along a first direction, where a second line passes between these pins, allowing for a single metal layer wiring with reduced jumper resistors, improving cost and heat dissipation while maintaining light uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple metal layers or numerous jumper resistors are used for electrical interconnection of LED beads, then the electrical connectivity is improved, but the cost increases and heat dissipation deteriorates

Engineering Contradiction:
Improveelectrical connectivityVSAvoidnumber of metal layers and jumper resistors
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple metal layers into a single metal layer by redesigning the LED bead structure. The anode and cathode lead frames are arranged in a planar configuration within the same layer, eliminating the need for multiple stacked metal layers while maintaining complete electrical connectivity for all LED beads in the array.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the jumper resistors from the system by redesigning the wiring approach. The single metal layer is configured to provide direct electrical pathways to all LED bead terminals without requiring additional jumper components, thereby reducing device complexity and cost.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If multiple metal layers are used for electrical interconnection, then electrical connectivity is improved, but heat dissipation deteriorates

Engineering Contradiction:
Improveelectrical connectivityVSAvoidheat dissipation
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent combines multiple metal layers into a single planar metal layer structure. This consolidation improves heat dissipation by reducing thermal resistance and creating a larger effective heat spreading area in the plane, while the lead frame design ensures all electrical connections are maintained within this single layer.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If numerous jumper resistors are provided on the LED light board, then electrical interconnection is improved, but cost increases

Engineering Contradiction:
Improveelectrical interconnectionVSAvoidnumber of jumper resistors
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the need for jumper resistors by designing a single metal layer configuration that provides direct electrical pathways to all LED bead terminals. The lead frame geometry is optimized to eliminate gaps in electrical connectivity, making additional jumper components unnecessary and thereby reducing cost and complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

4Device complexity

If a single metal layer is used with reduced jumper resistors, then cost is reduced and heat dissipation is improved, but electrical interconnection complexity increases

Engineering Contradiction:
Improvenumber of metal layers and jumper resistorsVSAvoidwiring layout complexity
Core Design Contradiction:
Device complexityVSEase of manufacture

Solution Approach 1:

The patent applies local quality optimization by strategically positioning the anode and cathode lead frames in specific locations within the single metal layer. The lead frame geometry and trace routing are locally optimized to provide efficient electrical pathways to each LED bead terminal, simplifying the overall wiring layout while maintaining manufacturing ease.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20260020418A1Inorganic light-emitting diode, light-emitting panel and backlight module
Publication Date: 2026.01.15 BOE MLED TECH CO LTD
  • US20260020418A1 patent drawing
  • US20260020418A1 patent drawing
  • US20260020418A1 patent drawing

AI summary

A light-emitting panel includes at least one light-emitting control region. In any one of the at least one light-emitting control region, the light-emitting panel includes inorganic light-emitting diodes distributed in an array and includes at least one first line extending along a first direction and at least one second line extending along a second direction. One of the inorganic light-emitting diodes has a plurality of first pins and a second pin. A first pin of one of two inorganic light-emitting diodes adjacent along the first direction is electrically connected to an adjacent first pin of the other one of the two inorganic light-emitting diodes through a corresponding first line, the second pin of one of the inorganic light-emitting diodes is electrically connected to a corresponding second line.