Inorganic LED Separation With Protective Insulating Layers
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Solution Overview
Problem
The manufacturing process of inorganic light emitting diodes (LEDs) using chemical methods often damages the insulating material layer surrounding the outer surface of the light emitting element, leading to potential damage and inefficiencies.
Innovation Solution
A manufacturing method involving the use of a protective layer with different etch selectivity to an etchant, comprising a first and second insulating layer, is applied to form a light emitting element with a flat and parallel end surface, ensuring the insulating material layer is protected during separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chemical method is used to separate the light emitting element, then the element rod can be separated from the lower substrate, but the insulating material layer surrounding the outer surface is partially damaged
Solution Approach 1:
A protective layer is introduced as an intermediary between the insulating material layer and the etchant. This protective layer has high etch selectivity resistance, preventing the etchant from damaging the insulating material layer while still allowing the separating layer to be removed for element rod separation.
Solution Approach 2:
The protective layer is formed on the insulating material layer before the chemical separation process. This preliminary protective coating ensures that when the etchant is applied to remove the separating layer, the insulating material layer is already protected and will not be damaged during the separation process.
2Device complexity
If chemical separation is performed without protective layer, then the manufacturing process is simple, but the surface roughness increases and causes open or short circuits
Solution Approach 1:
The protective layer serves as a mediator that protects the insulating material layer during chemical separation. This additional layer prevents surface roughness and electrical defects without significantly complicating the overall manufacturing process, as it can be integrated into existing deposition steps.
Solution Approach 2:
The protective layer provides beforehand cushioning by being positioned between the etchant and the insulating material layer. This protective barrier prevents direct contact between the etchant and the insulating material layer, cushioning against potential damage before it can occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method prevents damage to the insulating material layer and ensures a flat, parallel surface, reducing the risk of open or short circuits in the light emitting element, enhancing manufacturing precision and reliability.
Implementation Method 1
the second insulating layer may have an etch selectivity with respect to the etchant, which is greater than an etch selectivity of the separating layer with respect to the etchant
Data Source
AI summary
Provided are a light emitting device, a method for manufacturing same, and a display device including the light emitting device. The method for manufacturing the light emitting device comprises the steps of: preparing a lower substrate including a substrate and a buffer semiconductor layer formed on the substrate, forming an element rod by forming a separating layer disposed on the lower substrate, forming a first conductivity type semiconductor layer, an active material layer, and a second conductivity type semiconductor layer on the separating layer, and etching the first conductivity type semiconductor layer, the active material layer, the second conductivity type semiconductor layer, and the separating layer in a direction perpendicular to the lower substrate, forming a first insulating layer surrounding an outer circumferential surface of the element rod, forming a second insulating layer surrounding an outer circumferential surface of the first insulating layer and separating the element rod from the lower substrate to form a light emitting element.