Inorganic Bonded Phosphor Structures for High-Heat LED Packaging
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Solution Overview
Problem
Traditional techniques for bonding luminescent particles to semiconductor devices or other substrates result in degradation due to organic binders, leading to shorter lifespan and inefficiencies, especially under high temperature and high flux densities of short wavelength light.
Innovation Solution
An inorganic coating is applied using low-pressure deposition techniques to bond optically scattering and luminescent particles, forming a three-dimensional film with properties such as thermal expansion matching and refractive index matching, enhancing durability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic binder is used to bond luminescent particles, then bonding is achieved, but degradation and discoloration occur under high temperature and high flux densities
Solution Approach 1:
The patent changes the material parameter from organic binder to inorganic coating material, fundamentally altering the chemical composition to resist degradation under high temperature and high flux density conditions. This parameter change eliminates the degradation and discoloration issues inherent in organic binders while maintaining bonding functionality.
Solution Approach 2:
The patent employs composite material structure by combining inorganic coating layers with luminescent particles and semiconductor devices. This composite approach creates a bonded structure that leverages the thermal stability and chemical resistance of inorganic materials while preserving the optical and functional properties of the luminescent particles.
2Reliability
If inorganic coating is deposited using low-pressure deposition technique, then bonding durability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical or chemical bonding methods with a deposition-based coating process. By using low-pressure deposition techniques to apply inorganic coating layers, the bonding mechanism transitions from mechanical interlocking or chemical adhesion to physical vapor deposition, achieving superior bonding durability through controlled material deposition rather than complex assembly procedures.
3Ease of manufacture
If traditional bonding techniques are used, then manufacturing cost is reduced, but performance degradation occurs over time
Solution Approach 1:
The patent applies preliminary protective action by depositing inorganic coating layers on luminescent particles before bonding them to the semiconductor device. This preliminary coating prevents future degradation, discoloration, and performance loss that would occur with traditional bonding techniques, thereby ensuring long-term performance stability while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the longevity and performance of luminescent particle-based devices by reducing degradation and maintaining light emission efficiency over time, even under harsh conditions.
Implementation Method 1
An inorganic coating may be deposited onto the plurality of optically scattering particles using a low-pressure deposition technique
Implementation Method 2
The three-dimensional film may absorb or partially absorb this light and emit a light of a second wavelength
Data Source
AI summary
An inorganic coating may be applied to bond optically scattering particles or components. Optically scattering particles bonded via the inorganic coating may form a three dimensional film which can receive a light emission, convert, and emit the light emission with one or more changed properties. The inorganic coating may be deposited using a low-pressure deposition technique such as an atomic layer deposition (ALD) technique. Two or more components, such as an LED and a ceramic phosphor layer may be bonded together by depositing an inorganic coating using the ALD technique.