Inorganic Resist Pattern Embedding to Prevent Collapse
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Solution Overview
Problem
In semiconductor manufacturing, the use of inorganic resists often results in pattern collapse during the photolithography process, which is a defect that hinders the formation of fine patterns on substrates.
Innovation Solution
A substrate treatment method involving the development of an inorganic resist pattern with a developing solution, followed by filling the spaces between protrusions with an embedding solution, drying to form an embedded film, and reducing the film thickness using ultraviolet rays, which helps prevent pattern collapse by enhancing adhesion to the base film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inorganic resist is used for photolithography, then fine patterns can be formed, but pattern collapse occurs during the process
Solution Approach 1:
An organic film is formed on the substrate before applying the inorganic resist layer. This preliminary organic film serves as an adhesive promoter that enhances bonding between the inorganic resist and substrate, preventing pattern collapse during photolithography processing while maintaining the ability to form fine patterns.
Solution Approach 2:
The patent uses a composite structure consisting of an organic film layer combined with an inorganic resist layer. The organic film (formed from solutions containing organic polymers or surfactants) provides adhesion promotion, while the inorganic resist provides fine pattern formation capability, creating a composite system that resolves the contradiction between pattern precision and stability.
2Reliability
If embedding solution is supplied to fill spaces between protrusions, then pattern collapse is suppressed, but additional process steps are required
Solution Approach 1:
The patent combines the embedding treatment function with the organic film formation step. The same organic film that promotes adhesion also serves to fill and embed the spaces between pattern protrusions, eliminating the need for a separate embedding solution supply process while maintaining pattern stability.
Solution Approach 2:
The organic film performs multiple functions simultaneously: it acts as an adhesive promoter to prevent pattern collapse, fills the spaces between protrusions to provide mechanical support, and can be subsequently removed without affecting the pattern. This multi-functional approach reduces process complexity while achieving pattern stability.
3Manufacturing precision
If ultraviolet rays are used to reduce embedded film thickness, then pattern collapse is prevented, but UV treatment step is added
Solution Approach 1:
The patent uses ultraviolet irradiation to change the physical and chemical parameters of the organic film, making it removable. The UV treatment modifies the film's properties (such as cross-linking or degradation) so that it can be selectively removed after serving its adhesion and embedding functions, enabling pattern integrity without permanent film retention.
Solution Approach 2:
The organic film is used temporarily as a sacrificial layer that provides adhesion and structural support during pattern formation, then is removed after UV treatment. This temporary use and subsequent removal allows the film to fulfill its protective function without permanently complicating the final structure, maintaining pattern integrity while enabling clean-up.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses pattern collapse and improves the adhesion between the inorganic resist and the base film, allowing for the formation of finer patterns and reducing the load of removing the embedded film during etching processes.
Implementation Method 1
reducing a thickness of the embedded film by an ultraviolet ray
Data Source
AI summary
A substrate treatment method includes: developing a substrate which has a coating film of an inorganic resist formed on a base film thereon and has been subjected to an exposure treatment, with a developing solution to form a pattern of the inorganic resist; supplying an embedding solution to the developed substrate to fill a space between adjacent protrusions of the pattern; drying the filled embedding solution to form an embedded film on the substrate; and reducing a thickness of the embedded film by an ultraviolet ray.