Inorganic Substrate Bends for Wiring Board Impact Resistance
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Solution Overview
Problem
Thinner electronic component mounting boards with inorganic substrates are prone to cracking or breaking upon external impacts, which can disrupt signal transmission from electronic components due to inadequate stress distribution.
Innovation Solution
Incorporating a bond between the inorganic substrate and the wiring board, along with downward bends in the substrate to absorb stress, and using materials with differing thermal expansion coefficients to reduce deformation and enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the wiring board is made thinner to reduce device thickness, then the device thickness is reduced, but the wiring board becomes more susceptible to cracking or breaking under external impacts
Solution Approach 1:
The patent applies beforehand cushioning by forming a resin layer between the inorganic substrate and the wiring board before assembly. This resin layer acts as a cushioning element that absorbs external impacts before they reach the thinner wiring board, preventing cracks and breaks while allowing the wiring board to maintain its reduced thickness for device miniaturization.
Solution Approach 2:
The patent uses composite materials by combining the inorganic substrate, resin layer, and wiring board into a layered composite structure. The resin layer serves as an intermediate material with different mechanical properties than either the rigid inorganic substrate or the thin wiring board, creating a composite structure that distributes stress and protects the wiring board from impact damage.
2Length of moving object
If the wiring board is made thinner to reduce device thickness, then the device thickness is reduced, but the wiring board may fail to properly transmit signals from electronic components
Solution Approach 1:
The resin layer provides beforehand cushioning that prevents impact-induced cracks in the wiring board, thereby maintaining signal transmission reliability. By absorbing shocks before they reach the wiring board, the cushioning layer ensures that the thin wiring board remains intact and functional, preventing signal transmission failures that would otherwise occur due to impact damage.
3Stability of the object's composition
If materials with differing thermal expansion coefficients are used to reduce deformation, then thermal deformation is reduced, but the bonding between components becomes more complex
Solution Approach 1:
The resin layer serves as an intermediary between the inorganic substrate and the wiring board, mediating the thermal expansion differences between these two components. The resin's intermediate properties allow it to accommodate thermal expansion mismatches, reducing thermal deformation and stress while maintaining a relatively simple bonding structure without requiring complex stress compensation mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the likelihood of cracking or breaking in the wiring board, ensuring reliable signal transmission and minimizing damage from drops or external stress by distributing stress through the substrate's bends and bonding structure.
Implementation Method 1
The inorganic substrate includes downward bends outward from a bond area including the bond. The wiring board is a frame surrounding the electronic component mounting portion on an upper surface of the inorganic substrate. An electronic component mounting board including a thinner wiring board can receive external impacts applied to an inorganic substrate when dropped, which then affect the wiring board, or crack or break the wiring board.
Implementation Method 2
The bond is located between the inorganic substrate and the wiring board. The inorganic substrate includes downward bends outward from a bond area including the bond.
Data Source
AI summary
An electronic component mounting board includes an inorganic substrate, a wiring board, and a bond. The inorganic substrate includes an electronic component mounting portion in a central area of an upper surface of the inorganic substrate in which an electronic component is mountable. The wiring board is a frame surrounding the electronic component mounting portion on the upper surface of the inorganic substrate. The bond is located between the inorganic substrate and the wiring board. The inorganic substrate includes a downward bend outward from a bond area including the bond.