Inorganic Substrate Packaging for Thermal Mismatch and Moisture Venting

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Solution Overview

Problem

Existing package structures in semiconductor devices face challenges in managing thermal expansion mismatch and moisture/gas discharge, leading to reliability issues and inefficiencies in packaging techniques.

Innovation Solution

Incorporating an inorganic substrate, such as alkaline earth boro-aluminosilicate, with vent holes and trenches to manage thermal expansion and facilitate gas/moisture discharge, along with conductive connectors and underfill to enhance electrical connections and structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an inorganic substrate is added to manage thermal expansion mismatch, then package reliability is improved, but device complexity increases

Engineering Contradiction:

Improvepackage reliabilityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

An inorganic substrate layer is introduced as an intermediary between the organic package substrate and the semiconductor die. This intermediate layer acts as a thermal expansion buffer, absorbing the differential thermal stress between materials with different CTE values, thereby preventing reliability issues while maintaining a manageable package structure through functional segmentation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The package structure employs a composite material system combining organic package substrate, inorganic substrate layer, and semiconductor die. Each material is selected for its specific properties, creating a multi-material construction that optimizes thermal management and mechanical stability while addressing the inherent contradictions through material science rather than structural complexity alone.

Inventive Principle:

Principle #40Composite materials

2Reliability

If vent holes are formed in the inorganic substrate to discharge gas and moisture, then package reliability is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvepackage reliabilityVSAvoidvent hole formation precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The inorganic substrate is designed with a porous structure containing multiple vent holes that allow trapped gas and moisture to escape during the packaging process. This porous architecture provides reliable moisture and gas discharge pathways while the holes can be formed using standard manufacturing techniques, balancing reliability improvement with achievable manufacturing precision.

Inventive Principle:

Principle #31Porous materials

3Reliability

If trenches are formed in the inorganic substrate to contain molding material, then package reliability is improved, but device complexity increases

Engineering Contradiction:

Improvepackage reliabilityVSAvoidsubstrate structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The inorganic substrate is segmented by forming trenches that divide the molding material containment space into distinct regions. This segmentation prevents molding material overflow and ensures proper material distribution while maintaining a relatively simple overall substrate structure that can be manufactured using conventional processes.

Inventive Principle:

Principle #1Segmentation

4Reliability

If conductive connectors and underfill are added to enhance electrical connections, then electrical connectivity is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The conductive connectors are integrated directly into the inorganic substrate layer, merging the electrical connection function with the substrate structure. The underfill material is applied to simultaneously provide electrical connectivity enhancement and mechanical support. This merging of functions reduces the need for separate components while achieving improved electrical performance.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces thermal expansion mismatch and improves package reliability by managing moisture and gas discharge, enhancing electrical connectivity and structural integrity.

Implementation Method 1

The arrangement of the inorganic substrate may help to reduce the coefficients of thermal expansion (CTE) mismatch between the substrate and the chips

Methodology Applied

Scientific EffectThermal expansion mismatch: Thermal Expansion

Implementation Method 2

a plurality of vent holes may be formed in the inorganic substrate so as to facilitate the gas or moisture discharged from the underlying substrate

Methodology Applied

Scientific EffectGas discharge:

Data Source

PatentUS20260053013A1Package structure and method for fabricating the same

Publication Date: 2026.02.19 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure is provided. The package structure includes a package substrate, an inorganic substrate over the package substrate, and a package component over the inorganic substrate. The package structure includes a plurality of conductive connectors penetrating the inorganic substrate and electrically connected to the package component and the package substrate. The package structure also includes an underfill formed around the conductive connectors and between the package component and the inorganic substrate.