Inorganic Tackifier for Ceramic Matrix Composite Preforms

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing tackifiers used in polymer matrix composites are not compatible with the high temperatures and shrinkage processes of ceramic matrix composites, leading to thermal degradation and residual byproducts that affect the properties of ceramic matrix composites.

Innovation Solution

A tackifier composition comprising a carrier solvent, a resin material, and an inorganic filler, which is applied to woven fiber structures, facilitating their formation into preforms and later removal without leaving residues, ensuring compatibility and mechanical strength during ceramic processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If existing tackifiers used in polymer matrix composites are used for ceramic matrix composites, then fiber structure holding and handling are improved, but thermal degradation and residual byproducts occur affecting composite properties

Engineering Contradiction:
Improvefiber structure holding and handlingVSAvoidthermal degradation and residual byproducts
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The tackifier composition uses inorganic fillers (such as alumina, silica, or magnesia) with specific particle size distributions (D10, D50, D90 parameters) and chemical compositions that remain stable at ceramic processing temperatures. The resin material is selected to be compatible with high-temperature ceramic processing, changing the thermal stability parameter from polymer-based to inorganic-based, thereby eliminating thermal degradation while maintaining fiber holding capability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite tackifier system combining carrier solvent, resin material, and inorganic filler in specific proportions. This composite formulation provides both the adhesion properties needed for fiber holding and the thermal stability required for ceramic matrix composite processing, resolving the contradiction between operational ease and thermal harmlessness

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If carrier solvent is used in tackifier composition for easy application, then deposition and handling are facilitated, but additional drying step is required to remove solvent

Engineering Contradiction:
Improvedeposition and handlingVSAvoiddrying step
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The carrier solvent serves as a temporary medium that facilitates application but is intentionally designed to be evaporated completely during the drying step. Common solvents like water, ethanol, or acetone are used because they are inexpensive and easily removable, accepting the additional drying step as a necessary temporary measure to achieve proper tackifier deposition without leaving harmful residues

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The tackifier composition enables the formation of ceramic matrix composites by maintaining fiber structure integrity and mechanical strength, mitigating thermal degradation and shrinkage effects, and enhancing handling characteristics.

Implementation Method 1

dried to remove at least a portion of the carrier solvent

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentEP2327752B1Tackifier composition
Publication Date: 2015.10.21 UNITED TECH CORP
  • EP2327752B1 patent drawingFigure 1~3

AI summary

A tackifier composition includes a carrier solvent, a resin material, and an inorganic filler. The tackifier composition may be deposited onto at least a portion of a woven fiber structure and then dried to remove the carrier solvent. The dried woven fiber structure may then be formed into a preform.