Heterogeneous InP-SOI Phased Array Receiver for 2D Multi-Beam Radar
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Solution Overview
Problem
Current microwave photonic radar systems are limited by their ability to perform only one-dimensional single-beam scanning, restricting their application and system size reduction, while optically operated phased array chips can achieve two-dimensional simultaneous multi-beam scanning but with narrower bandwidth and higher complexity.
Innovation Solution
A programmable two-dimensional simultaneous multi-beam optically operated phased array receiver chip is developed through heterogeneous integration of InP and SOI photonic chips, incorporating DFB lasers, SOAs, silicon nitride optical power splitters, wavelength multiplexers, and true time delay lines to enable two-dimensional scanning with enhanced bandwidth and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If discrete optical devices are used to build microwave photonic radar systems, then broadband data processing capability is achieved, but system size cannot be reduced
Solution Approach 1:
The patent merges multiple discrete optical devices (lasers, modulators, delay lines, photodetectors) onto a single integrated photonic chip, combining functions that were previously implemented separately. This integration maintains the broadband data processing capability while dramatically reducing the overall system size and volume.
Solution Approach 2:
The integrated photonic chip implements a universal platform that can perform multiple functions including signal modulation, time delay, beamforming, and detection within a single device. This multi-functionality eliminates the need for separate discrete components while maintaining full signal processing capabilities.
2Ease of manufacture
If single-material platform integrated microwave photonic chips are used, then single function is achieved, but system functionality is limited
Solution Approach 1:
The patent employs composite material structures within the photonic chip, combining different material properties to enable multiple functions. For example, using materials with different refractive indices for waveguides and modulators, or combining piezoelectric materials with photonic structures to achieve both optical control and mechanical actuation, thereby expanding system functionality beyond what single-material platforms can provide.
3Ease of operation
If conventional phased array radar with electric phase shifter is used, then beam direction control is achieved, but beam squint occurs
Solution Approach 1:
The patent replaces the electric phase shifter system with an optical true time delay system. Instead of using electrical signals and phase shifters that cause beam squint, the system uses optical carriers with true time delay lines to control beam direction. This substitution eliminates beam squint while maintaining precise beam direction control capability.
4Adaptability or versatility
If optically operated phased array chip with narrow bandwidth is used, then two-dimensional simultaneous multi-beam scanning is achieved, but bandwidth is limited
Solution Approach 1:
The patent introduces wavelength division multiplexing as an additional dimension to expand bandwidth. By using multiple optical wavelengths simultaneously, each carrying independent beam signals, the system achieves both two-dimensional multi-beam scanning and ultra-wide bandwidth. This dimensional approach allows parallel transmission of multiple beams across the full bandwidth range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for miniaturization and practicalization of optically operated phased array radar systems, achieving ultra-wide bandwidth, low power consumption, and multi-functionality with two-dimensional multi-beam scanning capabilities, overcoming the limitations of existing systems.
Implementation Method 1
q distributed feedback (DFB) lasers... wavelengths of optical signals output by the q DFB lasers
Implementation Method 2
q semiconductor optical amplifiers (SOAs)... optical signals output by the DFB lasers on the InP photonic chip are amplified by the corresponding SOAs
Implementation Method 3
input ports of corresponding silicon nitride optical power splitters (SiN-OPS)
Implementation Method 4
two different SiN-based optical true time delay lines (SiN-OTTDLs)... after two stages of delaying through the SiN-OTTDL1 and the SiN-OTTDL2
Implementation Method 5
the optical signal is demodulated into an electrical signal through a germanium silicon photodetector (GeSi-PD)
Data Source
AI summary
A programmable two-dimensional simultaneous multi-beam optically operated phased array receiver chip is manufactured based on silicon-on-insulator (SOI) and indium phosphide (InP) semiconductor manufacturing processes, including the SiN process. The InP-based semiconductor is used for preparing a laser array chip and a semiconductor optical amplifier array chip, the SiN is used for preparing an optical power divider, and the SOI semiconductor is used for preparing a silicon optical modulator, a germanium-silicon detector, an optical wavelength multiplexer, a true delay line, and other passive optical devices. The whole integration of the receiver chip is realized through heterogeneous integration of the InP-based chip and the SOI-based chip. Simultaneous multi-beam scanning can be realized through peripheral circuit programming control. The chip not only can realize two-dimensional multi-beam scanning, but also has strong expansibility, such that the chip can be used for ultra-wideband high-capacity wireless communication and simultaneous multi-target radar recognition systems.