Indium Phosphide Polishing Device with Electrochemical-Mechanical Integration
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Solution Overview
Problem
Current polishing technologies for indium phosphide substrates, such as electrochemical and mechanical polishing, lack stability and uniformity, and require complex chemical compositions and stringent environmental conditions, making them costly and inefficient.
Innovation Solution
A polishing device and process that combines electrochemical and mechanical polishing, using an electrolyzer with a rotating anode and cathode, graphite electrode plate, and polishing cloth, with a polishing liquid injection system, to achieve a stable and uniform polishing effect with reduced environmental requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electrochemical polishing technology is used, then polishing effect can be achieved, but chemical compositions become complex and environmental requirements increase
Solution Approach 1:
The patent combines electrochemical polishing and mechanical polishing into a single integrated device. The electrochemical polishing section uses simple electrolyte solution with InP substrate as cathode, while the mechanical polishing section uses polishing cloth with abrasive particles. Both sections work sequentially on the same substrate to achieve superior polishing results while maintaining relatively simple chemical composition requirements.
2Manufacturing precision
If traditional electrochemical polishing is used, then polishing can be performed, but polishing uniformity and stability are not ideal
Solution Approach 1:
The integrated device combines electrochemical polishing that removes material uniformly through electrochemical reactions with mechanical polishing that provides consistent surface finish through abrasive action. The sequential process ensures both uniformity and stability in polishing results, overcoming the limitations of using either method alone.
Solution Approach 2:
The device enables continuous polishing operation where the substrate moves from the electrochemical polishing section to the mechanical polishing section without interruption. The electrolyte solution continuously circulates through the electrolyzer, and the polishing cloth maintains continuous contact with the substrate, ensuring stable and consistent polishing action throughout the process.
3Manufacturing precision
If mechanical polishing technology is used, then polishing can be performed, but polishing effect stability is insufficient
Solution Approach 1:
The patent integrates electrochemical polishing before mechanical polishing. The electrochemical section pre-treats the substrate surface by removing oxides and irregularities through controlled electrochemical reactions, creating a more uniform starting surface for the mechanical polishing section. This combination significantly improves the stability and consistency of the final polishing effect compared to mechanical polishing alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combined process achieves a surface roughness of 0.3 nm, reducing production costs by using low-cost electrolytes and polishing liquids, while ensuring ideal polishing results.
Implementation Method 1
the polishing of an InP single crystal substrate mainly adopts an electrochemical polishing technology or a mechanical polishing technology
Implementation Method 2
a smooth and less rough polishing interface is very important for the subsequent epitaxial growth
Data Source
AI summary
A polishing device for an indium phosphide substrate and a polishing process are provided, which belong to the technical field of polishing of indium phosphide. The polishing device includes an electrolyzer, and further includes an anode disc supporting rod positioned at a center position of a bottom of the electrolyzer by virtue of an anode lifting mechanism; an anode disc hinged to an upper end of the anode disc supporting rod; a cathode disc supporting rod positioned above the anode disc by virtue of a cathode lifting mechanism; a cathode disc arranged at a lower end of the cathode disc supporting rod; a graphite electrode plate arranged on the anode disc by virtue of a connection mechanism; a group of planet gears arranged on an upper end surface of the graphite electrode plate by virtue of an intermediate driving mechanism; an anode rotation driving mechanism connected to the intermediate driving mechanism; a cathode rotation driving mechanism connected to the cathode disc supporting rod; and a polishing direct current (DC) power supply respectively connected to contacts of the anode disc supporting rod and the cathode disc supporting rod by virtue of wires. By improving the structure of the device and the manufacturing process, a requirement for the environment in the polishing process of indium phosphide is greatly reduced, and electrochemical and mechanical dual-polishing is achieved.