Input Key With Segmented Plated And Non-Plated Plastic Layers
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Solution Overview
Problem
Existing electronic device keys with non-plated and plated plastic layers connected to a metal housing face issues with current leakage and weak connection strength between the layers, affecting device functionality and reliability.
Innovation Solution
A key design featuring a base and top cover made of different plastic materials, where the top cover is plated with a metal layer, and both are integrated using an injection mold process, with the top cover being roughened in an acidic solution to enhance bonding and prevent metal plating on the non-plated base, thereby improving connection strength and reducing current leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the key is connected to a metal housing, then the key can be integrated into the electronic device structure, but current can easily pass between the key and metal housing causing current leakage
Solution Approach 1:
The key is divided into two separate plastic layers (first plastic layer and second plastic layer) with different plating treatments. The first plastic layer has a metal plating layer providing electrical connection, while the second plastic layer remains non-plated to provide electrical insulation, thus segmenting the electrical properties within the unified key structure
Solution Approach 2:
Different regions of the key have different electrical properties: the first plastic layer is conductive due to metal plating for electrical connection with the metal housing, while the second plastic layer is insulating without plating to prevent current leakage, creating local quality differentiation to simultaneously achieve connection and insulation
2Device complexity
If the non-plated plastic layer and plated plastic layer are integrally formed, then the key structure is unified, but the connection strength between the two layers is low causing easy separation
Solution Approach 1:
A connection structure is pre-formed during the injection molding process before the key is assembled to the metal housing. The connection structure includes features such as protrusions or interlocking geometries that are created in advance during manufacturing, ensuring strong mechanical bonding between the first and second plastic layers without requiring additional assembly steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced bonding between the base and top cover increases the key's connection strength and prevents current leakage, ensuring stable electronic device operation.
Implementation Method 1
the top cover being roughened in an acidic solution to enhance bonding
Implementation Method 2
the top cover is plated with a metal layer
Data Source
AI summary
A key includes a base and a top cover. The base is made of a non-plated first plastic material. The base defines a through hole in a center portion, and a plurality of receiving portions surrounding and communicating with the through hole. The top cover is made of plated second plastic material. The top cover forms a plurality of connecting portions received in the receiving portions of the base The top cover is covered with a metal plating layer. A method of manufacturing a key is also provided.