Input Sensing Unit Mesh Pattern Overlap Reduction

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Solution Overview

Problem

Existing display devices face challenges in reducing the thickness of touch sensors and preventing resistance and short circuits between conductive lines, which affects the sensitivity and reliability of input sensing units, especially in flexible and deformable display devices.

Innovation Solution

The solution involves minimizing the overlapping area between the first and second conductive patterns in the input sensing unit, using a mesh pattern with specific line widths and shapes to reduce parasitic capacitance and prevent contamination from conductive particles, thereby enhancing sensitivity and preventing short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the overlapping area between the first conductive pattern and the second conductive pattern is reduced, then the sensitivity and reliability of the input sensing unit is improved, but the manufacturing complexity increases due to the need for precise mesh pattern alignment

Engineering Contradiction:
Improveinput sensing unit reliabilityVSAvoidmesh pattern alignment complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive patterns are divided into mesh structures with multiple small conductive lines arranged in a grid pattern. This segmentation reduces the overlapping area between the first and second conductive patterns while maintaining sufficient conductive pathways for signal transmission, thereby improving sensing reliability without requiring complete elimination of overlap

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The mesh pattern design allows different regions of the conductive patterns to have different local characteristics. By optimizing the mesh line width, spacing, and orientation in specific regions, the patent achieves reduced parasitic capacitance and minimized short circuit risk in critical areas while maintaining overall pattern alignment feasibility

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the mesh pattern line width is reduced to minimize overlapping area, then the parasitic capacitance is reduced and sensitivity is improved, but the manufacturing precision requirements increase

Engineering Contradiction:
Improveconductive pattern precisionVSAvoidinput sensing unit reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent optimizes the mesh pattern line width within a specific range to achieve the desired balance. By carefully selecting and controlling the line width parameter, the design reduces parasitic capacitance and overlapping area while maintaining manufacturing feasibility and avoiding excessive precision requirements that would compromise reliability

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the overlapping area between conductive patterns is minimized, then the risk of micro resistance and short circuits is reduced, but the area of the input sensing unit increases

Engineering Contradiction:
Improveshort circuit preventionVSAvoidinput sensing unit area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The mesh pattern segmentation allows the conductive lines to be distributed more efficiently across the sensing unit area. By using multiple thin conductive pathways arranged in a grid rather than thick overlapping lines, the patent reduces the risk of micro resistance and short circuits while maintaining a compact overall footprint

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP3640781B1Display device
Publication Date: 2023.08.23 SAMSUNG DISPLAY CO LTD

AI summary

A display device including a display panel including a light emitting element and an encapsulation layer covering the light emitting element; and an input sensing unit disposed on the display panel. The input sensing unit includes a first conductive pattern disposed on the encapsulation layer, and including a first portion and a second portion extend from the first portion; an insulation layer covering the first conductive pattern; and a second conductive pattern disposed on the insulation layer, and including a third portion overlapping the at least a portion of the first portion of the first conductive pattern and a fourth portion extend from the third portion. A width of the first portion is less than a width of the second portion.