Input Sensing Panel Dummy Patterns and Isolation for Display Noise
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Solution Overview
Problem
During the assembly of electronic devices, high-pressure pressing can cause a concavo-convex shape to form between the display panel and the input sensing panel, leading to a contrast pattern visible under illumination, and can also result in noise signals flowing through copper sheets, potentially damaging display driver IC chips during charging.
Innovation Solution
Incorporating dummy patterns co-planar with conductive patterns on the input sensing panel and using non-conductive tapes to isolate electrical paths, preventing noise signals from reaching display chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high-pressure pressing is applied to assemble the display panel and input sensing panel, then the bonding strength between panels is improved, but a concavo-convex shape forms causing visible contrast patterns
Solution Approach 1:
A pressing-resistant pattern layer is introduced as an intermediary between the display panel and input sensing panel. This pattern layer has pressing-resistant properties that prevent it from deforming under high-pressure bonding, thereby maintaining surface flatness while still allowing strong bonding between panels.
Solution Approach 2:
The pressing-resistant pattern layer is applied selectively to specific regions where concavo-convex deformation is most likely to occur during pressing. This localized application maintains overall surface flatness without requiring the entire panel structure to be modified, balancing bonding strength requirements with surface quality.
2Object-affected harmful factors
If copper sheets are used for electromagnetic shielding on the input sensing panel, then shielding effectiveness is improved, but noise signals can flow through the copper sheet damaging display driver IC chips
Solution Approach 1:
The copper sheet is divided into multiple isolated copper regions rather than forming a continuous conductive path. Each copper region is electrically isolated from others, which maintains electromagnetic shielding effectiveness in specific areas while preventing noise signals from propagating across the entire panel to the display driver IC chips.
Solution Approach 2:
The continuous conductive path of the copper sheet is extracted and replaced with discrete copper regions. This removal of the continuous path eliminates the mechanism by which noise signals could travel to damage IC chips, while the distributed copper regions still provide adequate electromagnetic shielding for their respective local areas.
3Shape
If dummy patterns are added to the input sensing panel, then contrast pattern visibility is reduced, but the device structure becomes more complex
Solution Approach 1:
The dummy patterns are merged with the functional conductive patterns of the input sensing panel during the same manufacturing process. This integration approach adds the contrast-reducing dummy patterns without requiring separate manufacturing steps, thereby minimizing the increase in device complexity while achieving the desired surface uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents the formation of visible contrast patterns on the display and effectively grounds noise signals, protecting display chips from electrical interference.
Implementation Method 1
a front surface of the touch panel is formed of a transparent electrode
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
An electronic device according to various embodiments of the present disclosure may include: a housing having first and second faces opposite to each other; a transparent substrate disposed on the first face of the housing; a display panel disposed below the transparent substrate; and an input sensing panel disposed below the display panel. The input sensing panel may include: a plurality of conductive patterns; and dummy patterns each disposed between each of the conductive patterns. Other various embodiments are also possible.