Input Sensor Wiring Defect Detection via Segmented Sensing Lines
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Solution Overview
Problem
Existing electronic devices with input sensors face challenges in detecting defects in the wiring of these sensors, which can lead to malfunction and are not effectively addressed by current technologies.
Innovation Solution
The electronic device incorporates a specific design for the input sensor, including a sensing electrode, signal line, ground line, sensing line, signal pad, ground pad, and dummy pad, with the sensing line overlapping the ground line and extending to connect with the dummy pad, allowing for detection of defects in the wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional input sensor design is used without additional sensing lines, then the device structure remains simple, but wiring defects cannot be detected
Solution Approach 1:
The sensing line is divided into multiple segments: a first sensing line extending from the signal line toward the ground line, and a second sensing line extending from the signal line toward the dummy pad. This segmentation allows independent detection of different wiring regions without requiring a complete redesign of the sensor structure.
Solution Approach 2:
The dummy pad is introduced as an intermediary element that enables detection of wiring defects between the signal line and the ground line. By creating an additional detection path through the dummy pad, the system can identify defects that would otherwise be undetectable in conventional designs.
2Reliability
If the sensing line overlaps with the ground line in the thickness direction, then wiring defects can be detected, but the risk of electrical interference increases
Solution Approach 1:
An insulating layer is introduced as an intermediary between the sensing line and the ground line. This insulating layer allows the sensing line to overlap with the ground line for defect detection purposes while preventing direct electrical contact and associated interference.
Solution Approach 2:
The sensing line is positioned in a different layer (thickness direction) than the ground line, allowing spatial overlap without electrical contact. This dimensional separation enables defect detection functionality while avoiding the harmful effects of direct line contact.
3Reliability
If multiple sensing lines are added to the input sensor, then defect detection capability improves, but manufacturing complexity increases
Solution Approach 1:
The sensing lines are merged with the existing signal line structure, sharing common conductive materials and fabrication processes. This integration approach enables defect detection functionality while minimizing additional manufacturing steps and complexity.
Solution Approach 2:
The sensing lines serve multiple functions: they detect wiring defects, maintain electrical signal pathways, and provide structural integrity to the sensor assembly. This multi-functionality reduces the need for separate dedicated defect detection structures.
Data Source
AI summary
An electronic device includes a display panel that displays an image and an input sensor disposed on the display panel and that includes an active area that senses an external input and a peripheral area adjacent to the active area. The input sensor includes a sensing electrode disposed in the active area, a signal line disposed in the peripheral area and electrically connected with the sensing electrode, a ground line disposed further away from the active area than the signal line, a sensing line that includes a first portion that overlaps the ground line, a signal pad disposed in the peripheral area and electrically connected with the signal line, a ground pad connected with the ground line, and a dummy pad disposed adjacent to the ground pad. One end of sensing line is connected with the dummy pad and an opposite end is connected with the ground line.