Input-Side Package Inductor VR for Lower Conduction Loss
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Solution Overview
Problem
Current voltage converters in computing devices face inefficiencies and high costs due to excessive conduction losses and the need for high-density conduction paths, especially in 3D-integrated systems with vertical power delivery architectures.
Innovation Solution
The implementation of a step-down converter topology with an inductor on the input side of the voltage regulator, cascaded with a current multiplier stage, reduces inductor size and losses, and improves efficiency by balancing current distribution and reducing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional voltage converter topology is used with vertical power delivery architecture, then power conversion is achieved, but excessive conduction losses occur and high-density conduction paths are required
Solution Approach 1:
The patent inverts the conventional voltage converter topology by placing the inductor on the input side rather than the output side. This inversion changes the current flow path so that the inductor handles the higher input current while the switching elements and output path handle lower currents, thereby reducing conduction losses in the critical high-current paths and eliminating the need for high-density conduction paths through the die
2Loss of energy
If inductor is placed on the output side of voltage regulator, then power conversion is achieved, but inductor size and losses are excessive
Solution Approach 1:
By inverting the topology to place the inductor on the input side, the patent allows the inductor to operate at higher frequencies with smaller current ripple, enabling the use of smaller inductors with lower losses. The input-side placement also allows better utilization of the magnetic core material and reduces the required inductance value
Solution Approach 2:
The patent changes the operating parameters by placing the inductor on the input side, which allows operation at higher switching frequencies and lower current ripple ratios. This parameter change enables the use of smaller inductors with fewer turns and smaller core sizes, directly reducing both inductor size and losses
3Power
If high-density conduction paths are used for vertical power delivery, then power conversion is achieved, but conduction losses increase
Solution Approach 1:
The inverted topology places the inductor on the input side where it can handle the full input current, while the switching elements and output path only handle the regulated output current. This redistribution of current paths eliminates the need for high-density conduction paths through the die, reducing conduction losses while maintaining full power delivery capability
Solution Approach 2:
The patent extracts the high-current handling function from the die internal paths and places it in the external inductor on the input side. This extraction removes the requirement for high-density conduction paths through the semiconductor die, thereby reducing conduction losses in the critical high-current paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration decreases inductor size and cost, lowers losses, and enhances efficiency by allowing for higher parasitic components and smaller decoupling capacitors, while providing unidirectional power flow and reducing the need for high-density conduction paths.
Implementation Method 1
a voltage converter including a first inductor L, an input node, and an input path in the package base layer
Implementation Method 2
DC-to-DC voltage converters can convert a power supply at one DC voltage to another, typically lower DC voltage
Data Source
AI summary
Embodiments herein relate to a voltage regular (VR) formed from a first die stacked on a package base layer. The VR can have an inductor-first design in which an inductor is in the package base layer and active circuitry such as switches is in the first die. The inductor receives an input voltage, Vin, directly from the package base layer without the input voltage first entering the first die. The VR can comprise a Kappa VR which includes first and second inductors in the package base layer. The inductors can have asymmetric inductances to improve efficiency. The VR can be cascaded with a set of current multipliers or a Continuously Scalable Conversion Ratio (CSCR) capacitive regulator. Another example implementation includes a switched-inductor-capacitor converter cascaded with a set of switched capacitor current multipliers.