InRow Liquid Cooling Module With Leak Detection for Dense IT Racks

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Solution Overview

Problem

Existing cooling systems, such as CRAC units, struggle to effectively manage the thermal environment in high-density electronic racks due to increased heat load, and liquid cooling solutions face challenges like leakage and compatibility issues with diverse IT equipment components.

Innovation Solution

The InRow liquid cooling module, which includes a main fluid distribution manifold, mounting section for cooling modules, and a leak detection mechanism, allows for adjustable cooling capacity and separate positioning from the electronic rack, using single-phase or two-phase liquid-to-liquid heat exchangers to create heat-transfer loops and mitigate leakage risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If CRAC units are used to cool conventional racks, then thermal environment is maintained, but cooling effectiveness deteriorates for high-power density racks

Engineering Contradiction:
Improvecooling effectivenessVSAvoidadaptability to high-power density
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The cooling system is divided into modular InRow cooling units that can be independently deployed alongside specific racks. Each module contains integrated components (manifold, heat exchangers, pumps) that can be scaled and configured to match the thermal density of individual racks, enabling effective cooling of high-power density equipment without requiring complete system replacement.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Liquid-to-liquid heat exchangers serve as intermediary devices between the rack-mounted cooling plates and the InRow cooling modules. This intermediate heat transfer mechanism allows thermal energy to be efficiently transferred from high-density electronics through coolant loops, bridging the gap between localized heat generation and centralized cooling capacity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If liquid cooling is implemented for high-density racks, then cooling efficiency is improved, but leakage risk increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidleakage damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The leak detection mechanism is extracted as a separate, dedicated subsystem within the InRow cooling module. This independent detection system continuously monitors coolant integrity and can isolate leaks before they cause damage to IT equipment, allowing the liquid cooling system to maintain high efficiency while mitigating the harmful effects of potential failures.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The system incorporates preventive leak detection and isolation capabilities that act as a cushion against potential leakage damage. By detecting leaks early and isolating affected sections before coolant can reach sensitive electronics, the system prepares defenses in advance rather than reacting to damage after it occurs.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Temperature

If liquid cooling modules are integrated within the electronic rack, then cooling is provided, but leakage risk to equipment increases

Engineering Contradiction:
Improvethermal controlVSAvoidequipment damage from leaks
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The liquid cooling modules are extracted from the electronic rack interior and positioned as separate InRow units alongside the racks. This spatial separation maintains thermal coupling through dedicated coolant loops while physically isolating the liquid cooling infrastructure from sensitive IT equipment, thereby providing effective cooling while eliminating the risk of leakage damage to electronics.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Coolant loops and heat exchangers serve as intermediary thermal transfer mechanisms between the InRow cooling modules and the electronic equipment. This intermediate thermal pathway enables efficient heat removal while maintaining physical separation between the liquid coolant and electronic components, solving both thermal control and leakage protection requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Device complexity

If a single cooling system is used for diverse equipment, then system simplicity is maintained, but adaptability to different thermal requirements deteriorates

Engineering Contradiction:
Improvesystem simplicityVSAvoidcompatibility with different equipment
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The InRow cooling modules are designed with universal interfaces and configurable cooling capacities that can accommodate multiple types of IT equipment with different thermal requirements. The modular architecture allows single InRow units to serve multiple racks or be scaled to match varying heat loads, providing adaptability across diverse equipment while maintaining relatively simple system operation through standardized protocols.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides efficient and adaptable liquid cooling for high-density racks, ensuring thermal equilibrium and reducing the risk of equipment damage from leaks, while accommodating different IT equipment types and sizes within a data center.

Implementation Method 1

Each cooling module is configured to 1) couple to the main supply line and to the main return line to circulate the coolant through the cooling module and 2) couple to a piece of IT equipment in an electronic rack via a supply line and a return line to create a heat-transfer loop that transfers thermal energy away from the piece of IT equipment and into the coolant that circulates through the module

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

using single-phase or two-phase liquid-to-liquid heat exchangers to create heat-transfer loops

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS11140799B2InRow liquid cooling module
Publication Date: 2021.10.05 BAIDU USA LLC
  • US11140799B2 patent drawing
  • US11140799B2 patent drawing
  • US11140799B2 patent drawing

AI summary

According to one embodiment, an InRow liquid cooling module for a database center includes a main fluid distribution manifold and a mounting section. The manifold has a main supply line that is configured to receive coolant from a coolant source and a main return line that is configured to return warmed coolant to the coolant source. The mounting section is configured to receive cooling modules, each module is configured to 1) couple to the main supply line and the main return line to circulate the coolant through the module and 2) couple to a piece of IT equipment in an electronic rack to create a heat-transfer loop that transfers thermal energy away from the equipment and into the coolant that circulates through the module. In one embodiment, the InRow concept may be deployed as part of a data center infrastructure or combined as part of an electronic IT rack.