In-Cell Touch Color Filter Substrate Surface Pad Exposure
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Solution Overview
Problem
The existing manufacturing process for in-cell touch panels requires high precision and slow application speeds for the conductive sealant to ensure precise contact between gold ball bonds and conductive pads, leading to increased production time due to the need for precise alignment and level differences in the substrate layers.
Innovation Solution
The solution involves forming through holes or slots in the first organic film layer in non-display areas, allowing conductive pads to connect directly with the first metal layer, which are then exposed through the second organic film layer, enabling direct contact with gold ball bonds and reducing the precision requirements for the sealant application, allowing for faster and more efficient coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive sealant is applied with high precision to ensure gold ball bonds contact conductive pads through deep holes, then the electrical connection reliability is improved, but the production time increases due to slow application speed
Solution Approach 1:
The patent changes the spatial arrangement from a vertical deep-hole structure to a planar surface structure. Through holes penetrating both organic film layers create a path requiring gold ball bonds to travel vertically through 4μm+ depth, while the invention exposes conductive pads on the surface level, allowing sealant to make contact in a single plane without deep vertical traversal, thus enabling faster application while maintaining connection reliability
Solution Approach 2:
The conductive pads are pre-exposed on the color filter substrate surface before sealant application. This preliminary exposure of pads in the non-display areas allows the sealant to directly contact the conductive pads without needing to precisely fill deep holes, reducing the precision requirement and enabling faster application speed
2Measurement precision
If the sealant is applied at low speed with high precision, then the gold ball bonds contact the conductive pads accurately, but the applying time is extended
Solution Approach 1:
The invention extracts the conductive pads from the deep interior structure and places them on the surface in non-display areas. By taking out the pads from the vertical stack and positioning them on the surface level, the sealant application no longer requires precise low-speed deposition into deep holes, but can use faster application methods while still achieving accurate contact
3Reliability
If through holes are formed in both organic film layers creating deep paths, then the gold ball bonds can connect the conductive pads, but the sealant application requires higher precision and slower speed
Solution Approach 1:
The patent transitions from a three-dimensional deep-hole filling approach to a two-dimensional surface-level contact approach. By exposing conductive pads on the surface in non-display areas, the sealant application becomes a planar process rather than a deep vertical process, significantly reducing the manufacturing precision requirements while maintaining electrical connection reliability
Data Source
AI summary
An in-cell touch color filter substrate is disclosed. The color filter substrate includes a substrate including a plurality of display areas and a plurality of non-display areas, where each non-display area surrounds one of the display areas. The color filter substrate also includes a first metal layer, a first organic film layer, a second metal layer including a plurality of conductive pads provided in the non-display areas, and a second organic film layer, successively formed on the substrate. In addition, a plurality of through holes or through slots are formed on the first organic film layer in the non-display areas, where the conductive pads electrically connect with the first metal layer via the through holes or through slots, and where the conductive pads are exposed through the second organic film layer.