Insert Case Molding with Slide-Core Terminal Fixing

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Solution Overview

Problem

Existing insert molding methods for semiconductor devices suffer from unstable moldability due to deformation and movement of terminal central portions during resin flow, leading to insufficient insulation distances and reliability issues.

Innovation Solution

A manufacturing method that fixes the central portion of the terminal using a slide core during insert molding, preventing deformation and movement by resin flow, and ensuring stable moldability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If guide pins are used to hold terminal end portions during insert molding, then terminal end portions are fixed and prevented from moving or deforming, but central portions of the terminals are not fixed and move or deform due to resin flow

Engineering Contradiction:

Improveterminal position accuracyVSAvoidinsulation distance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The terminal fixing function is segmented into multiple zones: guide pins handle end portion positioning while slide cores handle central portion positioning. This segmentation allows each component to address specific deformation issues without interfering with the other, ensuring comprehensive terminal stability throughout the molding process

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Slide cores act as intermediary components that bridge the gap between the mold and terminal central portions. These intermediaries transfer the fixing function from the mold to the terminal center, preventing direct resin contact with terminal central portions and eliminating deformation in this critical area

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If terminals are placed inside the mold without additional fixing mechanisms, then the molding process is simple, but the central portions of terminals move or deform due to resin flow

Engineering Contradiction:

Improvemolding process simplicityVSAvoidterminal shape stability

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

Slide cores are positioned and engaged with terminal central portions before the resin injection process begins. This preliminary action pre-establishes the terminal central portion positions, preventing deformation during the subsequent resin flow without complicating the overall molding setup

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The slide cores are designed to be movable relative to the mold, allowing them to dynamically adjust to terminal positions during insertion and then maintain fixed positions during molding. This dynamic capability enables automatic terminal centering while maintaining process simplicity

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS12488995B2Manufacturing method of insert case for semiconductor device and semiconductor device

Publication Date: 2025.12.02 MITSUBISHI ELECTRIC CORP

AI summary

A manufacturing method of an insert case for a semiconductor device includes: placing a terminal inside a mold and fixing a central portion of the terminal by bringing a slide core into contact with the central portion of the terminal; with the central portion of the terminal fixed by the slide core, filling an inside of the mold with resin to mold an insert case; and separating the slide core from the terminal and taking out the insert case from the mold.