Insert-Molded Connector Assembly With Grounded Base for Signal Integrity
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Solution Overview
Problem
The existing surface-mounting receptacle connector structures require a shield member on each receptacle contact, leading to a complicated structure and high manufacturing costs.
Innovation Solution
A connector design where the contact and housing are integrated by insert molding, featuring a metal base with a fixed part and projecting parts, an insulating layer, and conductive patterns, with the base's opposed-to-board surface exposed for soldering to a ground pattern, enhancing signal characteristics at a lower cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shield member is formed on the periphery of each receptacle contact, then signal characteristics are improved, but the structure becomes complicated and manufacturing cost increases
Solution Approach 1:
The patent merges the shield member function with the housing structure by making the housing itself conductive. The housing is formed with a conductive layer that serves both as the housing body and as the shield member, eliminating the need for separate shield components while maintaining signal shielding effectiveness
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: it provides mechanical support, electrical insulation (through insulating resin), and electromagnetic shielding (through the conductive layer). This multi-functional design eliminates the need for separate dedicated shield members for each contact
2Reliability
If a shield member is formed on the periphery of each receptacle contact, then signal characteristics are improved, but manufacturing cost increases
Solution Approach 1:
The shield function is combined with the housing manufacturing process. The conductive layer is applied to the housing in a single step during housing formation, eliminating the need for separate shield member fabrication and assembly operations, thereby reducing manufacturing cost
Solution Approach 2:
The conductive layer is applied to the housing in advance during the housing manufacturing process, before the connector assembly is completed. This preliminary formation of the shield structure eliminates subsequent shielding operations and reduces overall manufacturing complexity and cost
3Reliability
If the base is fully covered with housing, then insulation is improved, but solder connection to ground pattern becomes difficult
Solution Approach 1:
The housing coverage is designed with local variations: the base is covered with insulating resin in most areas to provide insulation, but specific regions are left exposed to enable solder connection. This localized differentiation allows both insulation and soldering requirements to be satisfied simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves signal characteristics while maintaining a stable impedance and reducing crosstalk, achieving a cost-effective and efficient connector assembly.
Implementation Method 1
an insulating layer covering the base
Implementation Method 2
a conductive pattern formed on the insulating layer, extending from the fixed part to the projecting part, and functioning as a contact
Implementation Method 3
the opposed-to board surface includes a solder connection part exposed toward the board without being covered with the housing so as to be soldered to a ground pattern of the board
Data Source
AI summary
A base includes a lower surface opposed to a lower board on which a receptacle is surface-mounted. The lower surface includes a solder connection part exposed toward the lower board without being covered with a housing so that it is soldered to a ground pattern of the lower board. This structure improves signal characteristics of a contact at low cost in a surface-mounting connector where the contact and the housing are integrated by insert molding. The signal characteristics of each conductive pattern are thereby improved at low cost.