Insert-Molded Connector Tongue for Solderless Signal Transmission
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Solution Overview
Problem
Conventional flexible flat cable manufacturing processes face challenges in maintaining the integrity of the insulating layer during the insert molding process, leading to potential damage and increased signal loss due to additional solder joints in connectors.
Innovation Solution
The proposed insert molded connector design features a tongue formed by insert molding that covers the contact portion and a portion of the coating insulating layer, exposing a contact surface while maintaining the high temperature resistance of the insulating layer, thus avoiding the need for separate insert molding of the contact portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the contact portion is formed by separate insert molding before welding, then the connector can be assembled, but the insulating layer is damaged by high temperature and additional solder joints increase signal loss
Solution Approach 1:
The patent merges the contact portion formation and insulating layer application into a single insert molding process. The tongue structure is molded directly onto the wires with the insulating layer already in place, eliminating the need for separate contact portion molding and subsequent welding operations. This integration resolves the contradiction by achieving connector assembly without damaging the insulating layer or adding solder joints that would degrade signal transmission.
Solution Approach 2:
The insulating layer is applied to the wires before the insert molding process begins. This preliminary action allows the insulating layer to be in its optimal state during molding, preventing temperature-related damage. The contact portion is then formed in a single step that doesn't require subsequent welding, thereby maintaining signal transmission reliability while achieving ease of manufacture.
2Shape
If the high temperature insert molding process is applied to the contact portion first, then the tongue structure is formed, but the insulating layer characteristics are affected or damaged
Solution Approach 1:
The patent combines the tongue structure formation with the insulating layer application in a single insert molding operation. The insulating layer is positioned on the wires before molding, and the tongue is formed simultaneously without exposing the insulating layer to damaging high temperatures. This merged process resolves the contradiction by achieving the required tongue shape while preserving insulating layer stability.
Solution Approach 2:
The patent changes the processing parameters by applying insert molding at temperatures and conditions that are compatible with the insulating layer material. By controlling the molding parameters to be non-damaging to the insulating layer, the tongue structure is formed while maintaining the insulating layer's physical and chemical characteristics, thus resolving the contradiction between shape formation and composition stability.
3Ease of manufacture
If multiple separate components and solder joints are used in the connector, then the connector can be assembled, but the structure becomes complex and signal loss increases
Solution Approach 1:
The patent merges multiple separate components (contact portion, insulating layer, tongue structure) into a single integrated insert-molded component. This consolidation eliminates the need for multiple assembly steps and solder joints, thereby reducing device complexity while maintaining ease of manufacture through the single-molding process. The integrated structure also reduces signal loss by eliminating intermediate connection points.
4Ease of manufacture
If additional solder joints are added to the connector, then the connector can be assembled, but signal loss increases and reliability decreases
Solution Approach 1:
The patent merges the contact portion formation into the main insert molding process, eliminating the need for separate welding operations. The tongue structure is formed directly during molding with proper electrical contact, removing solder joints from the signal path. This resolves the contradiction by achieving connector assembly without adding reliability-degrading solder joints.
Solution Approach 2:
The patent extracts and eliminates the solder joint step from the manufacturing process. By designing the insert molding to create self-contained electrical contacts within the molded structure, the need for subsequent welding is removed. This extraction of the harmful solder joint operation maintains ease of manufacture while preserving signal transmission reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maintains the original physical, chemical, and electrical characteristics of the insulating layer, simplifies the connector structure, and enhances reliability by reducing signal loss and eliminating the need for additional solder joints.
Implementation Method 1
the high temperature of the insert molding process will affect the characteristics of the insulating layer
Data Source
AI summary
An insert molded connector includes a plurality of wires arranged in parallel, a coating insulating layer, and a tongue. The plurality of wires are configured to transmit electrical signals. The coating insulating layer covers main portions of the wires to expose the contact portions of the wires. The tongue is insert molded to cover the contact portion and a portion of the coating insulating layer close to the contact portion to expose a contact surface of the contact portion.