Insert-Molded Heat Dissipation Module With EMI Shielding
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Solution Overview
Problem
Current heat dissipation modules in Netcom products face issues of poor assembly process efficiency, product yield, and reliability due to separate components requiring thermal interface materials, leading to thermal resistance and increased manufacturing complexity.
Innovation Solution
A heat dissipation module combining a thermally conductive plastic member and a metal member via insert molding, with integrated heat dissipation bosses and electromagnetic interference shielding capabilities, eliminating the need for thermal interface materials and enhancing structural reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat dissipation module uses separate radiators and metal shields assembled via white adhesive or screw locking, then electromagnetic interference shielding function is provided, but assembly process becomes time-consuming and product yield decreases
Solution Approach 1:
The patent combines the radiator and metal shield into a single integrated heat dissipation module. The metal shield is formed as an integral part of the radiator structure, eliminating the need for separate assembly steps with adhesives or screws. This merging of components directly resolves the contradiction by improving assembly efficiency while maintaining structural reliability through the integrated design.
Solution Approach 2:
The integrated heat dissipation module serves multiple functions simultaneously: it provides heat dissipation through the radiator structure, electromagnetic interference shielding through the integrated metal shield, and structural support. This multi-functionality eliminates the need for separate components and assembly processes, thereby improving productivity without compromising reliability.
2Reliability
If separate radiators and metal shields are assembled with thermal interface material, then thermal resistance between components is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the radiator and metal shield into a single integrated component structure. The metal shield is formed as an integral part of the radiator, eliminating the need for separate assembly steps and thermal interface materials. This reduces manufacturing complexity while maintaining reliable thermal contact, as the integrated structure ensures continuous thermal pathways without additional materials or assembly steps.
3Productivity
If thermally conductive plastic member and metal member are combined via insert molding, then assembly process is simplified, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses insert molding to combine the thermally conductive plastic member and metal member into a single integrated structure. This merging process simplifies subsequent assembly steps by eliminating the need for separate fastening operations. While insert molding requires precise manufacturing control, the integrated design ensures consistent thermal and structural performance, making the precision requirements manageable through proper process control.
4Reliability
If thermal interface material is used between separate components, then thermal contact is improved, but assembly time increases
Solution Approach 1:
The patent eliminates the need for thermal interface materials by integrating the metal shield directly into the radiator structure. The continuous metal structure provides inherent thermal pathways without requiring additional thermal compounds or adhesives. This merging of components maintains reliable thermal contact while eliminating the time-consuming application and curing processes associated with thermal interface materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design achieves efficient heat dissipation and electromagnetic interference shielding, reducing assembly processes and costs while improving product yield and structural reliability.
Implementation Method 1
The thermally conductive plastic member includes a base and a plurality of heat dissipation fins
Implementation Method 2
a heat dissipation module that may simultaneously provide heat dissipation and electromagnetic interference (EMI) shielding functions
Data Source
AI summary
The invention provides a heat dissipation module and an electronic device. The heat dissipation module includes a thermally conductive plastic member and a metal member. The thermally conductive plastic member includes a base and a plurality of heat dissipation fins. The base includes an upper surface and a lower surface opposite to each other, and the heat dissipation fins are arranged at intervals at the upper surface. The metal member is disposed at the lower surface of the base. The thermally conductive plastic member and the metal member are combined via insert molding. One of the thermally conductive plastic member and the metal member includes a plurality of heat dissipation bosses separated from each other, and the heat dissipation bosses are located at the lower surface of the base of the thermally conductive plastic member or at a surface of the metal member relatively far away from the base.